JPS5282075A - Apparatus for wire bonding - Google Patents

Apparatus for wire bonding

Info

Publication number
JPS5282075A
JPS5282075A JP15835675A JP15835675A JPS5282075A JP S5282075 A JPS5282075 A JP S5282075A JP 15835675 A JP15835675 A JP 15835675A JP 15835675 A JP15835675 A JP 15835675A JP S5282075 A JPS5282075 A JP S5282075A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15835675A
Other languages
Japanese (ja)
Other versions
JPS5424827B2 (en
Inventor
Seiichi Chiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP15835675A priority Critical patent/JPS5282075A/en
Publication of JPS5282075A publication Critical patent/JPS5282075A/en
Publication of JPS5424827B2 publication Critical patent/JPS5424827B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)
JP15835675A 1975-12-27 1975-12-27 Apparatus for wire bonding Granted JPS5282075A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15835675A JPS5282075A (en) 1975-12-27 1975-12-27 Apparatus for wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15835675A JPS5282075A (en) 1975-12-27 1975-12-27 Apparatus for wire bonding

Publications (2)

Publication Number Publication Date
JPS5282075A true JPS5282075A (en) 1977-07-08
JPS5424827B2 JPS5424827B2 (en) 1979-08-23

Family

ID=15669863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15835675A Granted JPS5282075A (en) 1975-12-27 1975-12-27 Apparatus for wire bonding

Country Status (1)

Country Link
JP (1) JPS5282075A (en)

Also Published As

Publication number Publication date
JPS5424827B2 (en) 1979-08-23

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