JPS52849A - Apparatus for molding - Google Patents

Apparatus for molding

Info

Publication number
JPS52849A
JPS52849A JP7670775A JP7670775A JPS52849A JP S52849 A JPS52849 A JP S52849A JP 7670775 A JP7670775 A JP 7670775A JP 7670775 A JP7670775 A JP 7670775A JP S52849 A JPS52849 A JP S52849A
Authority
JP
Japan
Prior art keywords
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7670775A
Other languages
Japanese (ja)
Inventor
Kiyomi Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7670775A priority Critical patent/JPS52849A/en
Publication of JPS52849A publication Critical patent/JPS52849A/en
Pending legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP7670775A 1975-06-24 1975-06-24 Apparatus for molding Pending JPS52849A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7670775A JPS52849A (en) 1975-06-24 1975-06-24 Apparatus for molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7670775A JPS52849A (en) 1975-06-24 1975-06-24 Apparatus for molding

Publications (1)

Publication Number Publication Date
JPS52849A true JPS52849A (en) 1977-01-06

Family

ID=13612984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7670775A Pending JPS52849A (en) 1975-06-24 1975-06-24 Apparatus for molding

Country Status (1)

Country Link
JP (1) JPS52849A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0559838U (en) * 1992-01-20 1993-08-06 株式会社三井ハイテック Resin encapsulation mold for semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0559838U (en) * 1992-01-20 1993-08-06 株式会社三井ハイテック Resin encapsulation mold for semiconductor devices

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