JPS5287664A - Method and device for soldering thick film part - Google Patents

Method and device for soldering thick film part

Info

Publication number
JPS5287664A
JPS5287664A JP325176A JP325176A JPS5287664A JP S5287664 A JPS5287664 A JP S5287664A JP 325176 A JP325176 A JP 325176A JP 325176 A JP325176 A JP 325176A JP S5287664 A JPS5287664 A JP S5287664A
Authority
JP
Japan
Prior art keywords
thick film
film part
soldering
soldering thick
thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP325176A
Other languages
Japanese (ja)
Inventor
Kouji Serizawa
Yoshio Tokumasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP325176A priority Critical patent/JPS5287664A/en
Publication of JPS5287664A publication Critical patent/JPS5287664A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP325176A 1976-01-16 1976-01-16 Method and device for soldering thick film part Pending JPS5287664A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP325176A JPS5287664A (en) 1976-01-16 1976-01-16 Method and device for soldering thick film part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP325176A JPS5287664A (en) 1976-01-16 1976-01-16 Method and device for soldering thick film part

Publications (1)

Publication Number Publication Date
JPS5287664A true JPS5287664A (en) 1977-07-21

Family

ID=11552237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP325176A Pending JPS5287664A (en) 1976-01-16 1976-01-16 Method and device for soldering thick film part

Country Status (1)

Country Link
JP (1) JPS5287664A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007142314A (en) * 2005-11-22 2007-06-07 Mitsubishi Electric Corp Solder bonding pretreatment apparatus, pretreatment method thereof, electronic component mounting apparatus using the same, and electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007142314A (en) * 2005-11-22 2007-06-07 Mitsubishi Electric Corp Solder bonding pretreatment apparatus, pretreatment method thereof, electronic component mounting apparatus using the same, and electronic component

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