JPS5292658U - - Google Patents
Info
- Publication number
- JPS5292658U JPS5292658U JP1976000245U JP24576U JPS5292658U JP S5292658 U JPS5292658 U JP S5292658U JP 1976000245 U JP1976000245 U JP 1976000245U JP 24576 U JP24576 U JP 24576U JP S5292658 U JPS5292658 U JP S5292658U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976000245U JPS5292658U (da) | 1976-01-07 | 1976-01-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976000245U JPS5292658U (da) | 1976-01-07 | 1976-01-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5292658U true JPS5292658U (da) | 1977-07-11 |
Family
ID=28460993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976000245U Pending JPS5292658U (da) | 1976-01-07 | 1976-01-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5292658U (da) |
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1976
- 1976-01-07 JP JP1976000245U patent/JPS5292658U/ja active Pending