JPS5295175A - Pellet bonding - Google Patents

Pellet bonding

Info

Publication number
JPS5295175A
JPS5295175A JP1145676A JP1145676A JPS5295175A JP S5295175 A JPS5295175 A JP S5295175A JP 1145676 A JP1145676 A JP 1145676A JP 1145676 A JP1145676 A JP 1145676A JP S5295175 A JPS5295175 A JP S5295175A
Authority
JP
Japan
Prior art keywords
pellet
pellet bonding
attaching
bonding
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1145676A
Other languages
Japanese (ja)
Inventor
Masayoshi Yoshimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1145676A priority Critical patent/JPS5295175A/en
Publication of JPS5295175A publication Critical patent/JPS5295175A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent from the pellet crack while bonding by attaching at the radiation board through the conductive adherent layer after attaching the pellet on the thin copper board by the use of gold silicon layer.
COPYRIGHT: (C)1977,JPO&Japio
JP1145676A 1976-02-06 1976-02-06 Pellet bonding Pending JPS5295175A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1145676A JPS5295175A (en) 1976-02-06 1976-02-06 Pellet bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1145676A JPS5295175A (en) 1976-02-06 1976-02-06 Pellet bonding

Publications (1)

Publication Number Publication Date
JPS5295175A true JPS5295175A (en) 1977-08-10

Family

ID=11778585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1145676A Pending JPS5295175A (en) 1976-02-06 1976-02-06 Pellet bonding

Country Status (1)

Country Link
JP (1) JPS5295175A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016208766A (en) * 2015-04-27 2016-12-08 株式会社デンソー Controller-integrated rotating electrical machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016208766A (en) * 2015-04-27 2016-12-08 株式会社デンソー Controller-integrated rotating electrical machine

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