JPS529975B2 - - Google Patents

Info

Publication number: JPS529975B2
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP48116332A

Other languages

Japanese (ja)

Other versions

JPS5068271A (2

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1973-10-18

Filing date

1973-10-18

Publication date

1977-03-19

1973-10-18 Application filed filed Critical

1973-10-18 Priority to JP48116332A priority Critical patent/JPS529975B2/ja

1975-06-07 Publication of JPS5068271A publication Critical patent/JPS5068271A/ja

1977-03-19 Publication of JPS529975B2 publication Critical patent/JPS529975B2/ja

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07521—Aligning
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Supply And Installment Of Electrical Components (AREA)
Wire Bonding (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)

JP48116332A 1973-10-18 1973-10-18 Expired JPS529975B2 (2)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP48116332A JPS529975B2 (2)	1973-10-18	1973-10-18

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP48116332A JPS529975B2 (2)	1973-10-18	1973-10-18

Publications (2)

Publication Number	Publication Date
JPS5068271A JPS5068271A (2)	1975-06-07
JPS529975B2 true JPS529975B2 (2)	1977-03-19

Family

ID=14684333

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP48116332A Expired JPS529975B2 (2)	1973-10-18	1973-10-18

Country Status (1)

Country	Link
JP (1)	JPS529975B2 (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS58122743A (ja) *	1982-01-14	1983-07-21	Toshiba Corp	ワイヤ・ボンデイング方法

1973
- 1973-10-18 JP JP48116332A patent/JPS529975B2/ja not_active Expired

Also Published As

Publication number	Publication date
JPS5068271A (2)	1975-06-07

Publication	Publication Date	Title
AR201758A1 (2)	1975-04-15
AU476761B2 (2)	1976-09-30
AU465372B2 (2)	1975-09-25
AR201235Q (2)	1975-02-21
AR201231Q (2)	1975-02-21
AU474593B2 (2)	1976-07-29
AU474511B2 (2)	1976-07-22
AU474838B2 (2)	1976-08-05
AU465453B2 (2)	1975-09-25
AU471343B2 (2)	1976-04-15
AU465434B2 (2)	1975-09-25
AU450229B2 (2)	1974-07-04
AU476714B2 (2)	1976-09-30
AR201229Q (2)	1975-02-21
AR199451A1 (2)	1974-08-30
AU476696B2 (2)	1976-09-30
AU472848B2 (2)	1976-06-03
AU466283B2 (2)	1975-10-23
AU477823B2 (2)	1975-06-19
JPS529975B2 (2)	1977-03-19
AR195311A1 (2)	1973-09-28
AU476873B1 (2)	1975-01-09
AR197627A1 (2)	1974-04-23
AR196382A1 (2)	1973-12-18
AR200256A1 (2)	1974-10-31