JPS53104155A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS53104155A
JPS53104155A JP1971877A JP1971877A JPS53104155A JP S53104155 A JPS53104155 A JP S53104155A JP 1971877 A JP1971877 A JP 1971877A JP 1971877 A JP1971877 A JP 1971877A JP S53104155 A JPS53104155 A JP S53104155A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
tape
shrinkage
give
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1971877A
Other languages
Japanese (ja)
Inventor
Masahiro Fukuyama
Fumio Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP1971877A priority Critical patent/JPS53104155A/en
Publication of JPS53104155A publication Critical patent/JPS53104155A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To give no shrinkage to tape, by fixing the surrounding part of pellet group of extended tape to the fixed ring.
COPYRIGHT: (C)1978,JPO&Japio
JP1971877A 1977-02-23 1977-02-23 Manufacture for semiconductor device Pending JPS53104155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1971877A JPS53104155A (en) 1977-02-23 1977-02-23 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1971877A JPS53104155A (en) 1977-02-23 1977-02-23 Manufacture for semiconductor device

Publications (1)

Publication Number Publication Date
JPS53104155A true JPS53104155A (en) 1978-09-11

Family

ID=12007070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1971877A Pending JPS53104155A (en) 1977-02-23 1977-02-23 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS53104155A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273719A (en) * 2006-03-31 2007-10-18 Disco Abrasive Syst Ltd Chip interval maintaining method and chip interval maintaining apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273719A (en) * 2006-03-31 2007-10-18 Disco Abrasive Syst Ltd Chip interval maintaining method and chip interval maintaining apparatus

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