JPS53112375U - - Google Patents
Info
- Publication number
- JPS53112375U JPS53112375U JP1977017548U JP1754877U JPS53112375U JP S53112375 U JPS53112375 U JP S53112375U JP 1977017548 U JP1977017548 U JP 1977017548U JP 1754877 U JP1754877 U JP 1754877U JP S53112375 U JPS53112375 U JP S53112375U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977017548U JPS53112375U (cs) | 1977-02-15 | 1977-02-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977017548U JPS53112375U (cs) | 1977-02-15 | 1977-02-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS53112375U true JPS53112375U (cs) | 1978-09-07 |
Family
ID=28843141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977017548U Pending JPS53112375U (cs) | 1977-02-15 | 1977-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53112375U (cs) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4866778A (cs) * | 1971-12-15 | 1973-09-12 | ||
| JPS49128679A (cs) * | 1973-04-09 | 1974-12-10 |
-
1977
- 1977-02-15 JP JP1977017548U patent/JPS53112375U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4866778A (cs) * | 1971-12-15 | 1973-09-12 | ||
| JPS49128679A (cs) * | 1973-04-09 | 1974-12-10 |