JPS53113228A - Method of attaching metal to selected portion of surface of substrate and its product - Google Patents

Method of attaching metal to selected portion of surface of substrate and its product

Info

Publication number
JPS53113228A
JPS53113228A JP2675878A JP2675878A JPS53113228A JP S53113228 A JPS53113228 A JP S53113228A JP 2675878 A JP2675878 A JP 2675878A JP 2675878 A JP2675878 A JP 2675878A JP S53113228 A JPS53113228 A JP S53113228A
Authority
JP
Japan
Prior art keywords
substrate
product
selected portion
attaching metal
attaching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2675878A
Other languages
English (en)
Inventor
Jieemusu Baron Uiriamu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Inc
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of JPS53113228A publication Critical patent/JPS53113228A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1415—Applying catalyst after applying plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2675878A 1977-03-11 1978-03-10 Method of attaching metal to selected portion of surface of substrate and its product Pending JPS53113228A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/776,814 US4073981A (en) 1977-03-11 1977-03-11 Method of selectively depositing metal on a surface

Publications (1)

Publication Number Publication Date
JPS53113228A true JPS53113228A (en) 1978-10-03

Family

ID=25108448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2675878A Pending JPS53113228A (en) 1977-03-11 1978-03-10 Method of attaching metal to selected portion of surface of substrate and its product

Country Status (9)

Country Link
US (1) US4073981A (ja)
JP (1) JPS53113228A (ja)
CA (1) CA1091813A (ja)
DE (1) DE2809842A1 (ja)
FR (1) FR2383245A1 (ja)
GB (1) GB1597759A (ja)
IT (1) IT7867535A0 (ja)
NL (1) NL7802618A (ja)
SE (1) SE7802255L (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188417A (en) * 1977-05-04 1980-02-12 Balzers Patent-und Beteiligungs-Aktiegesellschaft Method of applying a dielectric layer to a substrate and a mask-forming coating for the application of a dielectric layer
US4381951A (en) * 1978-01-25 1983-05-03 Western Electric Co. Inc. Method of removing contaminants from a surface
US4322457A (en) * 1978-01-25 1982-03-30 Western Electric Co., Inc. Method of selectively depositing a metal on a surface
US4421814A (en) * 1979-04-13 1983-12-20 Western Electric Co., Inc. Strippable resists
US4254163A (en) * 1979-04-13 1981-03-03 Western Electric Company, Inc. Strippable resists
EP0109402B1 (en) * 1982-05-26 1988-06-01 Macdermid, Incorporated Catalyst solutions for activating non-conductive substrates and electroless plating process
US4863758A (en) * 1982-05-26 1989-09-05 Macdermid, Incorporated Catalyst solutions for activating non-conductive substrates and electroless plating process
US4666735A (en) * 1983-04-15 1987-05-19 Polyonics Corporation Process for producing product having patterned metal layer
US4555414A (en) * 1983-04-15 1985-11-26 Polyonics Corporation Process for producing composite product having patterned metal layer
PH23907A (en) * 1983-09-28 1989-12-18 Rohm & Haas Catalytic process and systems
US4847114A (en) * 1984-01-26 1989-07-11 Learonal, Inc. Preparation of printed circuit boards by selective metallization
US4759952A (en) * 1984-01-26 1988-07-26 Learonal, Inc. Process for printed circuit board manufacture
US4761304A (en) * 1984-01-26 1988-08-02 Learonal, Inc. Process for printed circuit board manufacture
US5086966A (en) * 1990-11-05 1992-02-11 Motorola Inc. Palladium-coated solder ball
FR2672766A1 (fr) * 1991-02-08 1992-08-14 Eid Sa Procede selectif pour fabriquer un panneau de circuits imprimes, composition d'enduction et composition de nettoyage pour un substrat destine a supporter ledit panneau.
US6060121A (en) * 1996-03-15 2000-05-09 President And Fellows Of Harvard College Microcontact printing of catalytic colloids
US5827567A (en) * 1996-11-27 1998-10-27 Molitor; John Peter Game ball mold preparation technique and coating system
US7198747B2 (en) 2000-09-18 2007-04-03 President And Fellows Of Harvard College Fabrication of ceramic microstructures
US7255782B2 (en) * 2004-04-30 2007-08-14 Kenneth Crouse Selective catalytic activation of non-conductive substrates

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE23514E (en) 1930-06-26 1952-06-24 Artificial resins and process of
US2320724A (en) * 1940-03-14 1943-06-01 Pittsburgh Plate Glass Co Method of treating styrene-unsaturated dicarboxylic acid resins
US2286062A (en) * 1940-06-01 1942-06-09 Du Pont Process for copolymerizing malkic anhydride and polymerizable vinyl compounds
US2543601A (en) * 1949-12-06 1951-02-27 Rohm & Haas Polymeric imido-esters prepared from maleic heteropolymers and azolines
US2703756A (en) * 1951-12-12 1955-03-08 Gen Aniline & Film Corp Vesicular prints and process of making same
US2746837A (en) * 1951-12-28 1956-05-22 Gen Aniline & Film Corp Manufacture of leather using a modified vinyl ether-maleic anhydride copolymer, and resulting product
US2719141A (en) * 1954-07-07 1955-09-27 Eastman Kodak Co Hydantoin esters of maleic anhydride copolymers
US2854338A (en) * 1955-03-18 1958-09-30 Gen Aniline & Film Corp Negative working diazo sulfonate foils
US2816091A (en) * 1955-05-26 1957-12-10 Eastman Kodak Co Polymeric chalcones and their use as light-sensitive polymers
US2971842A (en) * 1956-03-21 1961-02-14 Gen Aniline & Film Corp Light sensitive layers for photomechanical reproduction
GB864033A (en) 1956-08-21 1961-03-29 Harris Intertype Corp Photo-lithographic plates and coating compositions therefor
US2882257A (en) * 1957-04-19 1959-04-14 Gen Aniline & Film Corp Polyester film of 2-butene-1, 4-diol and methyl vinyl ether-maleic anhydride copolymer crosslinked with n-vinyl-2-pyrrolidone and process for preparing same
US3072482A (en) * 1958-01-10 1963-01-08 Keuffel & Esser Co Subbed photographically sensitive film element
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3269861A (en) * 1963-06-21 1966-08-30 Day Company Method for electroless copper plating
US3532518A (en) * 1967-06-28 1970-10-06 Macdermid Inc Colloidal metal activating solutions for use in chemically plating nonconductors,and process of preparing such solutions
SE332214B (ja) * 1968-07-12 1971-02-01 Gylling & Co
US3657003A (en) * 1970-02-02 1972-04-18 Western Electric Co Method of rendering a non-wettable surface wettable
US3672925A (en) * 1970-10-02 1972-06-27 Rca Corp Method of preparing a substrate for depositing a metal on selected portions thereof

Also Published As

Publication number Publication date
GB1597759A (en) 1981-09-09
FR2383245A1 (fr) 1978-10-06
FR2383245B1 (ja) 1980-09-19
DE2809842A1 (de) 1978-09-14
CA1091813A (en) 1980-12-16
SE7802255L (sv) 1978-09-12
US4073981A (en) 1978-02-14
NL7802618A (nl) 1978-09-13
IT7867535A0 (it) 1978-03-10

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