JPS53142869A - Method of bonding lead frame to heat dissipating plate - Google Patents

Method of bonding lead frame to heat dissipating plate

Info

Publication number: JPS53142869A
Authority: JP; Japan
Prior art keywords: lead frame; heat dissipating; dissipating plate; bonding lead; bonding
Prior art date: 1977-05-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP5791077A

Other languages

English (en)

Japanese (ja)

Other versions

JPS5742224B2 (2

Inventor

Minoru Koike

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Canon Machinery Inc

Original Assignee

Nichiden Machinery Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1977-05-18

Filing date

1977-05-18

Publication date

1978-12-12

1977-05-18 Application filed by Nichiden Machinery Ltd filed Critical Nichiden Machinery Ltd

1977-05-18 Priority to JP5791077A priority Critical patent/JPS53142869A/ja

1978-12-12 Publication of JPS53142869A publication Critical patent/JPS53142869A/ja

1982-09-07 Publication of JPS5742224B2 publication Critical patent/JPS5742224B2/ja

Status Granted legal-status Critical Current

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices

Landscapes

Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

JP5791077A 1977-05-18 1977-05-18 Method of bonding lead frame to heat dissipating plate Granted JPS53142869A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP5791077A JPS53142869A (en)	1977-05-18	1977-05-18	Method of bonding lead frame to heat dissipating plate

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP5791077A JPS53142869A (en)	1977-05-18	1977-05-18	Method of bonding lead frame to heat dissipating plate

Publications (2)

Publication Number	Publication Date
JPS53142869A true JPS53142869A (en)	1978-12-12
JPS5742224B2 JPS5742224B2 (2)	1982-09-07

Family

ID=13069135

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP5791077A Granted JPS53142869A (en)	1977-05-18	1977-05-18	Method of bonding lead frame to heat dissipating plate

Country Status (1)

Country	Link
JP (1)	JPS53142869A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN102693953A (zh) *	2011-03-22	2012-09-26	株式会社东芝	半导体装置及其制造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS57172933U (2) *	1981-04-28	1982-10-30
JPS5952227U (ja) *	1982-09-29	1984-04-06	神鋼電機株式会社	電磁クラツチ
JPS62141931U (2) *	1986-02-28	1987-09-08

1977
- 1977-05-18 JP JP5791077A patent/JPS53142869A/ja active Granted

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN102693953A (zh) *	2011-03-22	2012-09-26	株式会社东芝	半导体装置及其制造方法
JP2012199436A (ja) *	2011-03-22	2012-10-18	Toshiba Corp	半導体装置及びその製造方法

Also Published As

Publication number	Publication date
JPS5742224B2 (2)	1982-09-07

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