JPS53145571A - Semiconductor element package - Google Patents
Semiconductor element packageInfo
- Publication number
- JPS53145571A JPS53145571A JP6152377A JP6152377A JPS53145571A JP S53145571 A JPS53145571 A JP S53145571A JP 6152377 A JP6152377 A JP 6152377A JP 6152377 A JP6152377 A JP 6152377A JP S53145571 A JPS53145571 A JP S53145571A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- element package
- package
- silver
- freame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To prevent silver migration and increase the durability of a package using a silver-plated freame by additionally increasing the substance distance between lead pins on the mold surface of the package.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6152377A JPS53145571A (en) | 1977-05-25 | 1977-05-25 | Semiconductor element package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6152377A JPS53145571A (en) | 1977-05-25 | 1977-05-25 | Semiconductor element package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS53145571A true JPS53145571A (en) | 1978-12-18 |
Family
ID=13173531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6152377A Pending JPS53145571A (en) | 1977-05-25 | 1977-05-25 | Semiconductor element package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53145571A (en) |
-
1977
- 1977-05-25 JP JP6152377A patent/JPS53145571A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS528785A (en) | Semiconductor device electrode structure | |
| JPS534472A (en) | Semiconductor package | |
| JPS53145571A (en) | Semiconductor element package | |
| JPS52153383A (en) | Preparation of semiconductor device | |
| JPS535571A (en) | Circuit block and its manufacture | |
| JPS52156561A (en) | Resin molded semiconductor device and its production | |
| JPS5251880A (en) | Moisture sensitive element | |
| JPS5258370A (en) | Semiconductor device | |
| JPS5283173A (en) | Circuit packaging substrate | |
| JPS51112292A (en) | Semiconductor device | |
| JPS5317274A (en) | Electrode structure of semiconductor element | |
| JPS5363866A (en) | Production of semiconductor device | |
| JPS5396670A (en) | Pellet bonding method | |
| JPS53139476A (en) | Manufacture of semiconductor device | |
| JPS52134375A (en) | Semiconductor package | |
| JPS547272A (en) | Semiconductor package | |
| JPS5345969A (en) | Schottky barrier semiconductor device | |
| JPS5365063A (en) | Semiconductor device | |
| JPS5372567A (en) | Semiconductor device | |
| JPS51112267A (en) | Semiconductor device | |
| JPS5283166A (en) | Semiconductor device and its production | |
| JPS53139974A (en) | Semiconductor device | |
| JPS5397367A (en) | Semiconductor device and its manufacture | |
| JPS5273675A (en) | Structure of die bonding | |
| JPS5325394A (en) | Se miconductor device |