JPS531863A - Printed circuit supporting board and method of producing same - Google Patents

Printed circuit supporting board and method of producing same

Info

Publication number
JPS531863A
JPS531863A JP7622777A JP7622777A JPS531863A JP S531863 A JPS531863 A JP S531863A JP 7622777 A JP7622777 A JP 7622777A JP 7622777 A JP7622777 A JP 7622777A JP S531863 A JPS531863 A JP S531863A
Authority
JP
Japan
Prior art keywords
printed circuit
supporting board
producing same
circuit supporting
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7622777A
Other languages
Japanese (ja)
Inventor
Aufusuto Puratsuaa Heruberuto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of JPS531863A publication Critical patent/JPS531863A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0284—Paper, e.g. as reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP7622777A 1976-06-28 1977-06-28 Printed circuit supporting board and method of producing same Pending JPS531863A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7607048A NL7607048A (en) 1976-06-28 1976-06-28 SUPPORT PLATE FOR PRINTED WIRES.

Publications (1)

Publication Number Publication Date
JPS531863A true JPS531863A (en) 1978-01-10

Family

ID=19826463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7622777A Pending JPS531863A (en) 1976-06-28 1977-06-28 Printed circuit supporting board and method of producing same

Country Status (4)

Country Link
JP (1) JPS531863A (en)
DE (1) DE2726912A1 (en)
FR (1) FR2356509A1 (en)
NL (1) NL7607048A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007519540A (en) * 2004-02-02 2007-07-19 エル アンド エル プロダクツ， インク． Improvements in or related to composite materials

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2525849B1 (en) * 1982-04-26 1985-08-09 Hutchinson PRINTED CIRCUIT SUBSTRATE
DE3316362C2 (en) * 1983-05-05 1985-03-07 Dynamit Nobel Ag, 5210 Troisdorf Laminate based on epoxy resin for printed circuits
ATE39598T1 (en) * 1985-08-14 1989-01-15 Toray Industries MULTILAYER CIRCUIT BOARD WITH EVENLY DISTRIBUTED FILLING PARTICLES AND PROCESS FOR THEIR MANUFACTURE.
FR2600941B1 (en) * 1986-07-02 1988-08-26 Alcatel Thomson Faisceaux COMPOSITE SUPPORT WITH METAL ENGRAVING

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007519540A (en) * 2004-02-02 2007-07-19 エル アンド エル プロダクツ， インク． Improvements in or related to composite materials

Also Published As

Publication number Publication date
NL7607048A (en) 1977-12-30
FR2356509A1 (en) 1978-01-27
DE2726912A1 (en) 1977-12-29

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