JPS5322363A - Method of sealing electronic parts - Google Patents

Method of sealing electronic parts

Info

Publication number
JPS5322363A
JPS5322363A JP9608576A JP9608576A JPS5322363A JP S5322363 A JPS5322363 A JP S5322363A JP 9608576 A JP9608576 A JP 9608576A JP 9608576 A JP9608576 A JP 9608576A JP S5322363 A JPS5322363 A JP S5322363A
Authority
JP
Japan
Prior art keywords
electronic parts
sealing electronic
sealing
parts
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9608576A
Other languages
Japanese (ja)
Other versions
JPS569014B2 (en
Inventor
Shigeyuki Shigesawa
Hiroshi Yanase
Michihiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP9608576A priority Critical patent/JPS5322363A/en
Publication of JPS5322363A publication Critical patent/JPS5322363A/en
Publication of JPS569014B2 publication Critical patent/JPS569014B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
JP9608576A 1976-08-13 1976-08-13 Method of sealing electronic parts Granted JPS5322363A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9608576A JPS5322363A (en) 1976-08-13 1976-08-13 Method of sealing electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9608576A JPS5322363A (en) 1976-08-13 1976-08-13 Method of sealing electronic parts

Publications (2)

Publication Number Publication Date
JPS5322363A true JPS5322363A (en) 1978-03-01
JPS569014B2 JPS569014B2 (en) 1981-02-26

Family

ID=14155551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9608576A Granted JPS5322363A (en) 1976-08-13 1976-08-13 Method of sealing electronic parts

Country Status (1)

Country Link
JP (1) JPS5322363A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0044136A1 (en) * 1980-07-04 1982-01-20 Asahi Glass Company Ltd. Encapsulation of electronic device
JPS5770157A (en) * 1980-10-21 1982-04-30 Dainippon Ink & Chem Inc Glass fiber-reinforced polyarylane sulfide resin composition
JPS5911357A (en) * 1982-07-09 1984-01-20 Asahi Glass Co Ltd Polyphenylene sulfide resin molding material
JPS6032848A (en) * 1983-08-01 1985-02-20 Mitsui Toatsu Chem Inc Polyphenylene sulfide resin composition
JPS62141064A (en) * 1985-12-16 1987-06-24 Polyplastics Co Thermoplastic resin sealing agent
JPS63108064A (en) * 1986-10-23 1988-05-12 Denki Kagaku Kogyo Kk Polyphenylene sulfide resin composition
JPH01168742A (en) * 1987-12-25 1989-07-04 Asahi Glass Co Ltd Resin composition for injection molding
JPH02180962A (en) * 1988-12-30 1990-07-13 Toopuren:Kk Polyphenylene sulfide resin composition
US4956499A (en) * 1987-03-30 1990-09-11 Kureha Kagaku Kogyo Kabushiki Kaisha Polyarylene thioether composition for molding
JPH06285881A (en) * 1993-04-06 1994-10-11 Kureha Chem Ind Co Ltd Sealing method of electronic part
JP2008127532A (en) * 2006-11-24 2008-06-05 Dic Corp Polyarylene sulfide resin composition
WO2024190398A1 (en) * 2023-03-10 2024-09-19 株式会社村田製作所 Capacitor element

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB618094A (en) * 1945-10-19 1949-02-16 Du Pont Plastic compositions containing glass fibres
JPS507705A (en) * 1973-05-25 1975-01-27
US3929708A (en) * 1974-08-15 1975-12-30 Phillips Petroleum Co Arylene sulfide polymers comprising silicone fluids
JPS517705A (en) * 1974-06-20 1976-01-22 Kubota Ltd KUTSUSAKUKI
JPS5112861A (en) * 1974-07-24 1976-01-31 Mitsui Petrochemical Ind HORIARIIRENSURUFUIDOJUSHISOSEIBUTSU

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB618094A (en) * 1945-10-19 1949-02-16 Du Pont Plastic compositions containing glass fibres
JPS507705A (en) * 1973-05-25 1975-01-27
JPS517705A (en) * 1974-06-20 1976-01-22 Kubota Ltd KUTSUSAKUKI
JPS5112861A (en) * 1974-07-24 1976-01-31 Mitsui Petrochemical Ind HORIARIIRENSURUFUIDOJUSHISOSEIBUTSU
US3929708A (en) * 1974-08-15 1975-12-30 Phillips Petroleum Co Arylene sulfide polymers comprising silicone fluids

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0044136A1 (en) * 1980-07-04 1982-01-20 Asahi Glass Company Ltd. Encapsulation of electronic device
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
JPS5770157A (en) * 1980-10-21 1982-04-30 Dainippon Ink & Chem Inc Glass fiber-reinforced polyarylane sulfide resin composition
JPS5911357A (en) * 1982-07-09 1984-01-20 Asahi Glass Co Ltd Polyphenylene sulfide resin molding material
JPS6032848A (en) * 1983-08-01 1985-02-20 Mitsui Toatsu Chem Inc Polyphenylene sulfide resin composition
JPS62141064A (en) * 1985-12-16 1987-06-24 Polyplastics Co Thermoplastic resin sealing agent
JPS63108064A (en) * 1986-10-23 1988-05-12 Denki Kagaku Kogyo Kk Polyphenylene sulfide resin composition
US4956499A (en) * 1987-03-30 1990-09-11 Kureha Kagaku Kogyo Kabushiki Kaisha Polyarylene thioether composition for molding
JPH01168742A (en) * 1987-12-25 1989-07-04 Asahi Glass Co Ltd Resin composition for injection molding
JPH02180962A (en) * 1988-12-30 1990-07-13 Toopuren:Kk Polyphenylene sulfide resin composition
JPH06285881A (en) * 1993-04-06 1994-10-11 Kureha Chem Ind Co Ltd Sealing method of electronic part
JP2008127532A (en) * 2006-11-24 2008-06-05 Dic Corp Polyarylene sulfide resin composition
WO2024190398A1 (en) * 2023-03-10 2024-09-19 株式会社村田製作所 Capacitor element

Also Published As

Publication number Publication date
JPS569014B2 (en) 1981-02-26

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