JPS5324254U - - Google Patents

Info

Publication number
JPS5324254U
JPS5324254U JP1976106639U JP10663976U JPS5324254U JP S5324254 U JPS5324254 U JP S5324254U JP 1976106639 U JP1976106639 U JP 1976106639U JP 10663976 U JP10663976 U JP 10663976U JP S5324254 U JPS5324254 U JP S5324254U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1976106639U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976106639U priority Critical patent/JPS5324254U/ja
Publication of JPS5324254U publication Critical patent/JPS5324254U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/60Strap connectors, e.g. thick copper clips for grounding of power devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/076Connecting or disconnecting of strap connectors
    • H10W72/07651Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/60Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631Shapes of strap connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP1976106639U 1976-08-09 1976-08-09 Pending JPS5324254U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976106639U JPS5324254U (2) 1976-08-09 1976-08-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976106639U JPS5324254U (2) 1976-08-09 1976-08-09

Publications (1)

Publication Number Publication Date
JPS5324254U true JPS5324254U (2) 1978-03-01

Family

ID=28716726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976106639U Pending JPS5324254U (2) 1976-08-09 1976-08-09

Country Status (1)

Country Link
JP (1) JPS5324254U (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55151345A (en) * 1979-05-16 1980-11-25 Hitachi Ltd Soldering method of chip

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140063A (2) * 1974-04-25 1975-11-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140063A (2) * 1974-04-25 1975-11-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55151345A (en) * 1979-05-16 1980-11-25 Hitachi Ltd Soldering method of chip

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