JPS5347384A - Sputtering apparatus - Google Patents

Sputtering apparatus

Info

Publication number
JPS5347384A
JPS5347384A JP12264476A JP12264476A JPS5347384A JP S5347384 A JPS5347384 A JP S5347384A JP 12264476 A JP12264476 A JP 12264476A JP 12264476 A JP12264476 A JP 12264476A JP S5347384 A JPS5347384 A JP S5347384A
Authority
JP
Japan
Prior art keywords
cathode
target
sputtering apparatus
driving source
offer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12264476A
Other languages
Japanese (ja)
Inventor
Taiji Hiraga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12264476A priority Critical patent/JPS5347384A/en
Publication of JPS5347384A publication Critical patent/JPS5347384A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To offer the sputtering apparatus capable of homogeneous consumption of the target, by moving the relative positions of the cathode and the target on this cathode with the driving source installed outside the vacuum tank and the sweep mechanism for transmitting the movement from the driving source to the target or the cathode.
JP12264476A 1976-10-13 1976-10-13 Sputtering apparatus Pending JPS5347384A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12264476A JPS5347384A (en) 1976-10-13 1976-10-13 Sputtering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12264476A JPS5347384A (en) 1976-10-13 1976-10-13 Sputtering apparatus

Publications (1)

Publication Number Publication Date
JPS5347384A true JPS5347384A (en) 1978-04-27

Family

ID=14841062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12264476A Pending JPS5347384A (en) 1976-10-13 1976-10-13 Sputtering apparatus

Country Status (1)

Country Link
JP (1) JPS5347384A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5567166U (en) * 1978-10-30 1980-05-09
JPS58189370A (en) * 1982-04-28 1983-11-05 Teijin Ltd Sputtering device
JPS6134177A (en) * 1984-07-25 1986-02-18 Tokuda Seisakusho Ltd Magnet driving device
JPS6198864U (en) * 1984-12-05 1986-06-24
JP2018021235A (en) * 2016-08-04 2018-02-08 株式会社アルバック Film forming unit for sputtering apparatus and film forming apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5567166U (en) * 1978-10-30 1980-05-09
JPS58189370A (en) * 1982-04-28 1983-11-05 Teijin Ltd Sputtering device
JPS6134177A (en) * 1984-07-25 1986-02-18 Tokuda Seisakusho Ltd Magnet driving device
JPS6198864U (en) * 1984-12-05 1986-06-24
JP2018021235A (en) * 2016-08-04 2018-02-08 株式会社アルバック Film forming unit for sputtering apparatus and film forming apparatus

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