JPS5366168A - Detection method for wire disconnection - Google Patents

Detection method for wire disconnection

Info

Publication number
JPS5366168A
JPS5366168A JP14124376A JP14124376A JPS5366168A JP S5366168 A JPS5366168 A JP S5366168A JP 14124376 A JP14124376 A JP 14124376A JP 14124376 A JP14124376 A JP 14124376A JP S5366168 A JPS5366168 A JP S5366168A
Authority
JP
Japan
Prior art keywords
detection method
wire disconnection
wire
disconnection
discharge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14124376A
Other languages
Japanese (ja)
Inventor
Yuzo Taniguchi
Michio Tanimoto
Isamu Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14124376A priority Critical patent/JPS5366168A/en
Publication of JPS5366168A publication Critical patent/JPS5366168A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning

Landscapes

  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE: To detect a wire disconnection state by detecting the discharge between the wire tip and the discharge electrode.
COPYRIGHT: (C)1978,JPO&Japio
JP14124376A 1976-11-26 1976-11-26 Detection method for wire disconnection Pending JPS5366168A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14124376A JPS5366168A (en) 1976-11-26 1976-11-26 Detection method for wire disconnection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14124376A JPS5366168A (en) 1976-11-26 1976-11-26 Detection method for wire disconnection

Publications (1)

Publication Number Publication Date
JPS5366168A true JPS5366168A (en) 1978-06-13

Family

ID=15287408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14124376A Pending JPS5366168A (en) 1976-11-26 1976-11-26 Detection method for wire disconnection

Country Status (1)

Country Link
JP (1) JPS5366168A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS549576A (en) * 1977-06-24 1979-01-24 Shinkawa Seisakusho Kk Method of detecting formed pole at wire bonding unit
JPS567442A (en) * 1979-06-29 1981-01-26 Hitachi Ltd Wire bonding device
JPS57192043A (en) * 1981-05-20 1982-11-26 Shinkawa Ltd Method for forming ball in wire bonder
JPS6211242A (en) * 1986-06-27 1987-01-20 Hitachi Ltd Wire bonding device
JPS6357146U (en) * 1986-10-01 1988-04-16

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS549576A (en) * 1977-06-24 1979-01-24 Shinkawa Seisakusho Kk Method of detecting formed pole at wire bonding unit
JPS567442A (en) * 1979-06-29 1981-01-26 Hitachi Ltd Wire bonding device
JPS57192043A (en) * 1981-05-20 1982-11-26 Shinkawa Ltd Method for forming ball in wire bonder
JPS6211242A (en) * 1986-06-27 1987-01-20 Hitachi Ltd Wire bonding device
JPS6357146U (en) * 1986-10-01 1988-04-16

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