JPS5371267A - Method of perforating multilayer printed board - Google Patents

Method of perforating multilayer printed board

Info

Publication number
JPS5371267A
JPS5371267A JP14608976A JP14608976A JPS5371267A JP S5371267 A JPS5371267 A JP S5371267A JP 14608976 A JP14608976 A JP 14608976A JP 14608976 A JP14608976 A JP 14608976A JP S5371267 A JPS5371267 A JP S5371267A
Authority
JP
Japan
Prior art keywords
perforating
printed board
multilayer printed
multilayer
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14608976A
Other languages
Japanese (ja)
Inventor
Keiji Kurosawa
Yuukichi Takeda
Haruo Kawamata
Masanori Nakai
Kiyoshi Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14608976A priority Critical patent/JPS5371267A/en
Publication of JPS5371267A publication Critical patent/JPS5371267A/en
Pending legal-status Critical Current

Links

Landscapes

  • Drilling And Boring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP14608976A 1976-12-07 1976-12-07 Method of perforating multilayer printed board Pending JPS5371267A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14608976A JPS5371267A (en) 1976-12-07 1976-12-07 Method of perforating multilayer printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14608976A JPS5371267A (en) 1976-12-07 1976-12-07 Method of perforating multilayer printed board

Publications (1)

Publication Number Publication Date
JPS5371267A true JPS5371267A (en) 1978-06-24

Family

ID=15399872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14608976A Pending JPS5371267A (en) 1976-12-07 1976-12-07 Method of perforating multilayer printed board

Country Status (1)

Country Link
JP (1) JPS5371267A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5654095A (en) * 1979-10-09 1981-05-13 Fujitsu Ltd Method of manufacturing through hole plated printed circuit board
JPS5914696A (en) * 1982-07-16 1984-01-25 日立コンデンサ株式会社 Method of producing printed circuit board
JPH02183596A (en) * 1989-01-09 1990-07-18 Nec Corp Manufacture of multilayer printed circuit board
US5010641A (en) * 1989-06-30 1991-04-30 Unisys Corp. Method of making multilayer printed circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5654095A (en) * 1979-10-09 1981-05-13 Fujitsu Ltd Method of manufacturing through hole plated printed circuit board
JPS5914696A (en) * 1982-07-16 1984-01-25 日立コンデンサ株式会社 Method of producing printed circuit board
JPH02183596A (en) * 1989-01-09 1990-07-18 Nec Corp Manufacture of multilayer printed circuit board
US5010641A (en) * 1989-06-30 1991-04-30 Unisys Corp. Method of making multilayer printed circuit board

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