JPS5378768A - Wire bonding method of semiconductor element - Google Patents

Wire bonding method of semiconductor element

Info

Publication number
JPS5378768A
JPS5378768A JP15424476A JP15424476A JPS5378768A JP S5378768 A JPS5378768 A JP S5378768A JP 15424476 A JP15424476 A JP 15424476A JP 15424476 A JP15424476 A JP 15424476A JP S5378768 A JPS5378768 A JP S5378768A
Authority
JP
Japan
Prior art keywords
semiconductor element
wire bonding
bonding method
make
speedy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15424476A
Other languages
Japanese (ja)
Inventor
Takeshi Yoshimatsu
Hideo Kawai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15424476A priority Critical patent/JPS5378768A/en
Publication of JPS5378768A publication Critical patent/JPS5378768A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: Not only to make it possible to prevent the connection error of the pad and the lead wire, but also to easily detect the bonding position and to make it speedy, by forming to the respective specific shapes several bonding pads of the semiconductor pellet.
COPYRIGHT: (C)1978,JPO&Japio
JP15424476A 1976-12-23 1976-12-23 Wire bonding method of semiconductor element Pending JPS5378768A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15424476A JPS5378768A (en) 1976-12-23 1976-12-23 Wire bonding method of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15424476A JPS5378768A (en) 1976-12-23 1976-12-23 Wire bonding method of semiconductor element

Publications (1)

Publication Number Publication Date
JPS5378768A true JPS5378768A (en) 1978-07-12

Family

ID=15579976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15424476A Pending JPS5378768A (en) 1976-12-23 1976-12-23 Wire bonding method of semiconductor element

Country Status (1)

Country Link
JP (1) JPS5378768A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5739435U (en) * 1980-08-19 1982-03-03
JPS5759445U (en) * 1980-09-24 1982-04-08
JPS5869961U (en) * 1981-11-05 1983-05-12 日本電気株式会社 hybrid integrated circuit
JPH01310548A (en) * 1988-06-08 1989-12-14 Nec Corp Semiconductor integrated circuit device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5739435U (en) * 1980-08-19 1982-03-03
JPS5759445U (en) * 1980-09-24 1982-04-08
JPS5869961U (en) * 1981-11-05 1983-05-12 日本電気株式会社 hybrid integrated circuit
JPH01310548A (en) * 1988-06-08 1989-12-14 Nec Corp Semiconductor integrated circuit device

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