JPS5380970A - Manufacture of resin shield type semiconductor device - Google Patents

Manufacture of resin shield type semiconductor device

Info

Publication number
JPS5380970A
JPS5380970A JP15649776A JP15649776A JPS5380970A JP S5380970 A JPS5380970 A JP S5380970A JP 15649776 A JP15649776 A JP 15649776A JP 15649776 A JP15649776 A JP 15649776A JP S5380970 A JPS5380970 A JP S5380970A
Authority
JP
Japan
Prior art keywords
semiconductor device
manufacture
type semiconductor
shield type
resin shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15649776A
Other languages
Japanese (ja)
Other versions
JPS611897B2 (en
Inventor
Akira Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15649776A priority Critical patent/JPS5380970A/en
Publication of JPS5380970A publication Critical patent/JPS5380970A/en
Publication of JPS611897B2 publication Critical patent/JPS611897B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To hold the semiconductor device only with a specified lead after resin shielding and to have cut off and individualization after selection and marking.
COPYRIGHT: (C)1978,JPO&Japio
JP15649776A 1976-12-27 1976-12-27 Manufacture of resin shield type semiconductor device Granted JPS5380970A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15649776A JPS5380970A (en) 1976-12-27 1976-12-27 Manufacture of resin shield type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15649776A JPS5380970A (en) 1976-12-27 1976-12-27 Manufacture of resin shield type semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP58172941A Division JPS5976456A (en) 1983-09-21 1983-09-21 Resin sealed type semiconductor device

Publications (2)

Publication Number Publication Date
JPS5380970A true JPS5380970A (en) 1978-07-17
JPS611897B2 JPS611897B2 (en) 1986-01-21

Family

ID=15629036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15649776A Granted JPS5380970A (en) 1976-12-27 1976-12-27 Manufacture of resin shield type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5380970A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55166945A (en) * 1979-06-13 1980-12-26 Nec Corp Lead frame
JPH0377460U (en) * 1990-11-08 1991-08-05
JPH0513485A (en) * 1991-07-03 1993-01-22 Rohm Co Ltd Electronic component manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55166945A (en) * 1979-06-13 1980-12-26 Nec Corp Lead frame
JPH0377460U (en) * 1990-11-08 1991-08-05
JPH0513485A (en) * 1991-07-03 1993-01-22 Rohm Co Ltd Electronic component manufacturing method

Also Published As

Publication number Publication date
JPS611897B2 (en) 1986-01-21

Similar Documents

Publication Publication Date Title
JPS5339842A (en) Antenna for small size radio
JPS5325798A (en) Shielding material for radioactive ray
JPS5211245A (en) Phenolic resin composition
JPS52129380A (en) Semiconductor device
JPS542667A (en) Manufacture of semiconductor device
JPS5320857A (en) Semiconductor device
JPS51146190A (en) Diode circuit
JPS53124073A (en) Sealing unit for glass sealing type semiconductor device
JPS548834A (en) Semiconductor rectifying device
JPS52143186A (en) Taping device
JPS5321398A (en) Neutron protective material and its production
JPS5338974A (en) Manufacture of semiconductor device
JPS5360176A (en) Semiconductor device
JPS5377168A (en) Production of semiconductor device
JPS5374366A (en) Manufacture of semiconductor device
JPS533071A (en) Semiconductor device
JPS5345969A (en) Schottky barrier semiconductor device
JPS5324191A (en) Cutter
JPS5411672A (en) Manufacture for semiconductor device
JPS52140135A (en) Vehicle.s trouble indicating device
JPS51135164A (en) Device of changing the direction of wind
JPS5379390A (en) Photo thyristor
JPS51115197A (en) Adhesive tape cutter
JPS5223928A (en) Electronic instrument
JPS52119862A (en) Semi-conductor device and its manufacture