JPS5381073A - Oroduction of resin seal type semiconductor device and lead frame used the same - Google Patents

Oroduction of resin seal type semiconductor device and lead frame used the same

Info

Publication number
JPS5381073A
JPS5381073A JP15653176A JP15653176A JPS5381073A JP S5381073 A JPS5381073 A JP S5381073A JP 15653176 A JP15653176 A JP 15653176A JP 15653176 A JP15653176 A JP 15653176A JP S5381073 A JPS5381073 A JP S5381073A
Authority
JP
Japan
Prior art keywords
lead frame
oroduction
semiconductor device
same
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15653176A
Other languages
Japanese (ja)
Other versions
JPS5730307B2 (en
Inventor
Akira Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15653176A priority Critical patent/JPS5381073A/en
Publication of JPS5381073A publication Critical patent/JPS5381073A/en
Publication of JPS5730307B2 publication Critical patent/JPS5730307B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To achieve the rationalization and expedition of work by supporting the molding part of a pellet with mold strips on a lead frame and treating in a multilinked state.
COPYRIGHT: (C)1978,JPO&Japio
JP15653176A 1976-12-27 1976-12-27 Oroduction of resin seal type semiconductor device and lead frame used the same Granted JPS5381073A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15653176A JPS5381073A (en) 1976-12-27 1976-12-27 Oroduction of resin seal type semiconductor device and lead frame used the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15653176A JPS5381073A (en) 1976-12-27 1976-12-27 Oroduction of resin seal type semiconductor device and lead frame used the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP56161012A Division JPS57132345A (en) 1981-10-12 1981-10-12 Lead frame

Publications (2)

Publication Number Publication Date
JPS5381073A true JPS5381073A (en) 1978-07-18
JPS5730307B2 JPS5730307B2 (en) 1982-06-28

Family

ID=15629818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15653176A Granted JPS5381073A (en) 1976-12-27 1976-12-27 Oroduction of resin seal type semiconductor device and lead frame used the same

Country Status (1)

Country Link
JP (1) JPS5381073A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521124A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame
JPS5587469A (en) * 1978-12-25 1980-07-02 Fujitsu Ltd Semiconductor device and its manufacture
JPS5632462U (en) * 1979-08-20 1981-03-30
JPS59136956A (en) * 1983-01-25 1984-08-06 Rohm Co Ltd Semiconductor device
JPS59143334A (en) * 1983-02-03 1984-08-16 Rohm Co Ltd Manufacture of semiconductor device
JPS59148354A (en) * 1983-02-15 1984-08-25 Internatl Rectifier Corp Japan Ltd Lead frame for semiconductor device
JPS60121751A (en) * 1984-07-25 1985-06-29 Hitachi Ltd Semiconductor device
JPS6271253A (en) * 1985-07-23 1987-04-01 フエアチヤイルド　セミコンダクタ　コ−ポレ−シヨン Semiconductor chip package structure, its test and facilitating method for mounting on substrate
JPS63205941A (en) * 1987-02-23 1988-08-25 Sony Corp Semiconductor device
JPS6489354A (en) * 1987-09-29 1989-04-03 Nec Corp Flat package
JPH0334358A (en) * 1989-06-29 1991-02-14 Nec Corp Manufacture of resin sealed semiconductor device
JPH04127459A (en) * 1990-09-18 1992-04-28 Nec Kyushu Ltd Manufacture of semiconductor device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521124A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame
JPS5587469A (en) * 1978-12-25 1980-07-02 Fujitsu Ltd Semiconductor device and its manufacture
JPS5632462U (en) * 1979-08-20 1981-03-30
JPS59136956A (en) * 1983-01-25 1984-08-06 Rohm Co Ltd Semiconductor device
JPS59143334A (en) * 1983-02-03 1984-08-16 Rohm Co Ltd Manufacture of semiconductor device
JPS59148354A (en) * 1983-02-15 1984-08-25 Internatl Rectifier Corp Japan Ltd Lead frame for semiconductor device
JPS60121751A (en) * 1984-07-25 1985-06-29 Hitachi Ltd Semiconductor device
JPS6271253A (en) * 1985-07-23 1987-04-01 フエアチヤイルド　セミコンダクタ　コ−ポレ−シヨン Semiconductor chip package structure, its test and facilitating method for mounting on substrate
JPS63205941A (en) * 1987-02-23 1988-08-25 Sony Corp Semiconductor device
JPS6489354A (en) * 1987-09-29 1989-04-03 Nec Corp Flat package
JPH0334358A (en) * 1989-06-29 1991-02-14 Nec Corp Manufacture of resin sealed semiconductor device
JPH04127459A (en) * 1990-09-18 1992-04-28 Nec Kyushu Ltd Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS5730307B2 (en) 1982-06-28

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