JPS5381568U - - Google Patents
Info
- Publication number
- JPS5381568U JPS5381568U JP1977153302U JP15330277U JPS5381568U JP S5381568 U JPS5381568 U JP S5381568U JP 1977153302 U JP1977153302 U JP 1977153302U JP 15330277 U JP15330277 U JP 15330277U JP S5381568 U JPS5381568 U JP S5381568U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19742405930 DE2405930C3 (de) | 1974-02-07 | Halbleiterbauelement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5381568U true JPS5381568U (2) | 1978-07-06 |
Family
ID=5906872
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50015238A Pending JPS50115773A (2) | 1974-02-07 | 1975-02-05 | |
| JP1977153302U Pending JPS5381568U (2) | 1974-02-07 | 1977-11-15 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50015238A Pending JPS50115773A (2) | 1974-02-07 | 1975-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JPS50115773A (2) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54181873U (2) * | 1978-06-13 | 1979-12-22 | ||
| JPS5855649Y2 (ja) * | 1978-12-04 | 1983-12-20 | 三菱電機株式会社 | 半導体装置 |
| US4313128A (en) * | 1979-05-08 | 1982-01-26 | Westinghouse Electric Corp. | Compression bonded electronic device comprising a plurality of discrete semiconductor devices |
| JPS5829622B2 (ja) * | 1981-10-30 | 1983-06-23 | 三菱電機株式会社 | 制御電極端子付圧接形半導体装置の組立て方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4112338Y1 (2) * | 1965-01-13 | 1966-06-10 |
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1975
- 1975-02-05 JP JP50015238A patent/JPS50115773A/ja active Pending
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1977
- 1977-11-15 JP JP1977153302U patent/JPS5381568U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4112338Y1 (2) * | 1965-01-13 | 1966-06-10 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2405930B2 (de) | 1976-10-07 |
| JPS50115773A (2) | 1975-09-10 |
| DE2405930A1 (de) | 1975-08-21 |