JPS5384679A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5384679A
JPS5384679A JP16064376A JP16064376A JPS5384679A JP S5384679 A JPS5384679 A JP S5384679A JP 16064376 A JP16064376 A JP 16064376A JP 16064376 A JP16064376 A JP 16064376A JP S5384679 A JPS5384679 A JP S5384679A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
contacting
lead frame
improve productivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16064376A
Other languages
Japanese (ja)
Inventor
Noboru Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16064376A priority Critical patent/JPS5384679A/en
Publication of JPS5384679A publication Critical patent/JPS5384679A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To improve productivity by contacting and connecting the opposing leads of a lead frame to plural bump electrodes.
COPYRIGHT: (C)1978,JPO&Japio
JP16064376A 1976-12-29 1976-12-29 Production of semiconductor device Pending JPS5384679A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16064376A JPS5384679A (en) 1976-12-29 1976-12-29 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16064376A JPS5384679A (en) 1976-12-29 1976-12-29 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5384679A true JPS5384679A (en) 1978-07-26

Family

ID=15719360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16064376A Pending JPS5384679A (en) 1976-12-29 1976-12-29 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5384679A (en)

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