JPS5388575A - Production of lead frame for semiconductor device - Google Patents

Production of lead frame for semiconductor device

Info

Publication number
JPS5388575A
JPS5388575A JP340677A JP340677A JPS5388575A JP S5388575 A JPS5388575 A JP S5388575A JP 340677 A JP340677 A JP 340677A JP 340677 A JP340677 A JP 340677A JP S5388575 A JPS5388575 A JP S5388575A
Authority
JP
Japan
Prior art keywords
lead frame
production
semiconductor device
leads
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP340677A
Other languages
Japanese (ja)
Other versions
JPS5947462B2 (en
Inventor
Kazuo Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP52003406A priority Critical patent/JPS5947462B2/en
Publication of JPS5388575A publication Critical patent/JPS5388575A/en
Publication of JPS5947462B2 publication Critical patent/JPS5947462B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain a frame having different lead patterns with the same die by mounting punches to the die which forms the lead frame having a plurality of leads by punching thereby cutting and removing unnecessary leads.
JP52003406A 1977-01-13 1977-01-13 Lead configuration for semiconductor devices Expired JPS5947462B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52003406A JPS5947462B2 (en) 1977-01-13 1977-01-13 Lead configuration for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52003406A JPS5947462B2 (en) 1977-01-13 1977-01-13 Lead configuration for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS5388575A true JPS5388575A (en) 1978-08-04
JPS5947462B2 JPS5947462B2 (en) 1984-11-19

Family

ID=11556493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52003406A Expired JPS5947462B2 (en) 1977-01-13 1977-01-13 Lead configuration for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5947462B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194382A (en) * 1982-05-08 1983-11-12 Matsushita Electric Ind Co Ltd Electrode structure for semiconductor device
JPS59107150U (en) * 1982-12-31 1984-07-19 ロ−ム株式会社 Small transistor lead frame

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62102355U (en) * 1985-12-19 1987-06-30

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194382A (en) * 1982-05-08 1983-11-12 Matsushita Electric Ind Co Ltd Electrode structure for semiconductor device
JPS59107150U (en) * 1982-12-31 1984-07-19 ロ−ム株式会社 Small transistor lead frame

Also Published As

Publication number Publication date
JPS5947462B2 (en) 1984-11-19

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