JPS54103747U - - Google Patents
Info
- Publication number
- JPS54103747U JPS54103747U JP1977178443U JP17844377U JPS54103747U JP S54103747 U JPS54103747 U JP S54103747U JP 1977178443 U JP1977178443 U JP 1977178443U JP 17844377 U JP17844377 U JP 17844377U JP S54103747 U JPS54103747 U JP S54103747U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
Landscapes
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Packaging Frangible Articles (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977178443U JPS5841188Y2 (ja) | 1977-12-29 | 1977-12-29 | 半導体用ボンデイングワイヤ−のスプ−ルケ−ス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977178443U JPS5841188Y2 (ja) | 1977-12-29 | 1977-12-29 | 半導体用ボンデイングワイヤ−のスプ−ルケ−ス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54103747U true JPS54103747U (2) | 1979-07-21 |
| JPS5841188Y2 JPS5841188Y2 (ja) | 1983-09-17 |
Family
ID=29188907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977178443U Expired JPS5841188Y2 (ja) | 1977-12-29 | 1977-12-29 | 半導体用ボンデイングワイヤ−のスプ−ルケ−ス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5841188Y2 (2) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100398832B1 (ko) | 2001-10-31 | 2003-09-19 | 헤라우스오리엔탈하이텍 주식회사 | 본딩 와이어용 스풀 케이스 및 이 케이스를 사용한 스풀취급 방법 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4422252Y1 (2) * | 1967-04-11 | 1969-09-19 |
-
1977
- 1977-12-29 JP JP1977178443U patent/JPS5841188Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4422252Y1 (2) * | 1967-04-11 | 1969-09-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5841188Y2 (ja) | 1983-09-17 |