JPS54132269U - - Google Patents
Info
- Publication number
- JPS54132269U JPS54132269U JP1978028906U JP2890678U JPS54132269U JP S54132269 U JPS54132269 U JP S54132269U JP 1978028906 U JP1978028906 U JP 1978028906U JP 2890678 U JP2890678 U JP 2890678U JP S54132269 U JPS54132269 U JP S54132269U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978028906U JPS54132269U (de) | 1978-03-06 | 1978-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978028906U JPS54132269U (de) | 1978-03-06 | 1978-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54132269U true JPS54132269U (de) | 1979-09-13 |
Family
ID=28875760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978028906U Pending JPS54132269U (de) | 1978-03-06 | 1978-03-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54132269U (de) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50109667A (de) * | 1974-02-04 | 1975-08-28 |
-
1978
- 1978-03-06 JP JP1978028906U patent/JPS54132269U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50109667A (de) * | 1974-02-04 | 1975-08-28 |