JPS5414181A - Semiconductor laser unit - Google Patents

Semiconductor laser unit

Info

Publication number
JPS5414181A
JPS5414181A JP8026577A JP8026577A JPS5414181A JP S5414181 A JPS5414181 A JP S5414181A JP 8026577 A JP8026577 A JP 8026577A JP 8026577 A JP8026577 A JP 8026577A JP S5414181 A JPS5414181 A JP S5414181A
Authority
JP
Japan
Prior art keywords
semiconductor laser
laser unit
enlarging
improve
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8026577A
Other languages
Japanese (ja)
Inventor
Ryuichi Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8026577A priority Critical patent/JPS5414181A/en
Publication of JPS5414181A publication Critical patent/JPS5414181A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02375—Positioning of the laser chips
    • H01S5/02385—Positioning of the laser chips using laser light as reference
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0236—Fixing laser chips on mounts using an adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02375—Positioning of the laser chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To improve the thermal dissipation efficiency, by providing grooves on the heat sink surface and enlarging the contact surface through adhesive coupling of laser elements.
JP8026577A 1977-07-04 1977-07-04 Semiconductor laser unit Pending JPS5414181A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8026577A JPS5414181A (en) 1977-07-04 1977-07-04 Semiconductor laser unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8026577A JPS5414181A (en) 1977-07-04 1977-07-04 Semiconductor laser unit

Publications (1)

Publication Number Publication Date
JPS5414181A true JPS5414181A (en) 1979-02-02

Family

ID=13713466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8026577A Pending JPS5414181A (en) 1977-07-04 1977-07-04 Semiconductor laser unit

Country Status (1)

Country Link
JP (1) JPS5414181A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4603419A (en) * 1980-06-17 1986-07-29 Matsushita Electric Industrial Co., Ltd. Semiconductor laser structure including dual mounts having ridge and groove engagement
JPS62185387A (en) * 1986-02-10 1987-08-13 Hitachi Ltd Photo-semiconductor element
US4768199A (en) * 1985-09-05 1988-08-30 Siemens Aktiengesellschaft Mechanism for self-adjusting positioning of a semiconductor laser relative to an optical fiber to be coupled thereto
JPH03136287A (en) * 1989-10-20 1991-06-11 Sanyo Electric Co Ltd Semiconductor laser
US5040187A (en) * 1990-01-03 1991-08-13 Karpinski Arthur A Monolithic laser diode array
US5284790A (en) * 1990-01-03 1994-02-08 Karpinski Arthur A Method of fabricating monolithic laser diode array
WO2000063967A1 (en) * 1999-04-20 2000-10-26 Toyo Kohan Co., Ltd. Heat sink base, heat sink, and method of manufacturing heat sink
JP2009158688A (en) * 2007-12-26 2009-07-16 Sony Corp Light emitting device assembly and method for manufacturing the same
JP2015170701A (en) * 2014-03-06 2015-09-28 技術研究組合光電子融合基盤技術研究所 optical integrated circuit device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5043895A (en) * 1973-08-20 1975-04-19
JPS5079286A (en) * 1973-11-12 1975-06-27

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5043895A (en) * 1973-08-20 1975-04-19
JPS5079286A (en) * 1973-11-12 1975-06-27

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4603419A (en) * 1980-06-17 1986-07-29 Matsushita Electric Industrial Co., Ltd. Semiconductor laser structure including dual mounts having ridge and groove engagement
US4768199A (en) * 1985-09-05 1988-08-30 Siemens Aktiengesellschaft Mechanism for self-adjusting positioning of a semiconductor laser relative to an optical fiber to be coupled thereto
JPS62185387A (en) * 1986-02-10 1987-08-13 Hitachi Ltd Photo-semiconductor element
JPH03136287A (en) * 1989-10-20 1991-06-11 Sanyo Electric Co Ltd Semiconductor laser
US5040187A (en) * 1990-01-03 1991-08-13 Karpinski Arthur A Monolithic laser diode array
US5284790A (en) * 1990-01-03 1994-02-08 Karpinski Arthur A Method of fabricating monolithic laser diode array
WO2000063967A1 (en) * 1999-04-20 2000-10-26 Toyo Kohan Co., Ltd. Heat sink base, heat sink, and method of manufacturing heat sink
JP2009158688A (en) * 2007-12-26 2009-07-16 Sony Corp Light emitting device assembly and method for manufacturing the same
US7787512B2 (en) 2007-12-26 2010-08-31 Sony Corporation Light-emitting element assembly and method for manufacturing the same
US8372670B2 (en) 2007-12-26 2013-02-12 Sony Corporation Light-emitting element assembly and method for manufacturing the same
JP2015170701A (en) * 2014-03-06 2015-09-28 技術研究組合光電子融合基盤技術研究所 optical integrated circuit device

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