JPS54150480A - Continuous manufacture of metal foil clad laminate - Google Patents

Abstract

PURPOSE: The title manufacture of printed circuit boards, etc, in a simple process without using solvents, by applying a metal foil to a thin sheet molded from a thermosetting resin composition, and by hot-pressing and curing the laminate with a given degree of thickness accuracy.

CONSTITUTION: A composition which is a solid at room temperature and comprises 100 parts by wt. of a thermosetting resin and 500 parts by wt. of an inorganic filler is molded at the softening point to a temperature to cure 10% of the resin within 30 min, a retention time in the extruder and cylinder of 1 min to 1/2 of the curing time, and an extrusion linear velocity (V) at the screw head ≥10cm/min, a ratio of the extrvsion linear velocity at the sheet die head to V of 1.0W15.0 into a sheet 3 having a thickness of 0.5W5.0 mm and a ratio of the width to thickness of 300W2,000. The sheet is extruded on the metal foil 4 on the endless belt, hot- pressed by the belt press 5, cured by the oven 6, cooled by the rolls 7 and cut by the cutter 8 to give the metal foil clad laminate 9. A metal foil may be applied to a continuous reinforcing material layer laminated on the sheet 3 and semicured by irradiation with light or electron rays.

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