JPS5423794B2 - - Google Patents

Info

Publication number: JPS5423794B2
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP1052575A

Other languages

Japanese (ja)

Other versions

JPS5185669A (fr

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1975-01-27

Filing date

1975-01-27

Publication date

1979-08-16

1975-01-27 Application filed filed Critical

1975-01-27 Priority to JP1052575A priority Critical patent/JPS5423794B2/ja

1976-07-27 Publication of JPS5185669A publication Critical patent/JPS5185669A/ja

1979-08-16 Publication of JPS5423794B2 publication Critical patent/JPS5423794B2/ja

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/521—Structures or relative sizes of bond wires
- H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating

Landscapes

Wire Bonding (AREA)

JP1052575A 1975-01-27 1975-01-27 Expired JPS5423794B2 (fr)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1052575A JPS5423794B2 (fr)	1975-01-27	1975-01-27

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1052575A JPS5423794B2 (fr)	1975-01-27	1975-01-27

Publications (2)

Publication Number	Publication Date
JPS5185669A JPS5185669A (fr)	1976-07-27
JPS5423794B2 true JPS5423794B2 (fr)	1979-08-16

Family

ID=11752652

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1052575A Expired JPS5423794B2 (fr)	1975-01-27	1975-01-27

Country Status (1)

Country	Link
JP (1)	JPS5423794B2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN105810652A (zh) *	2015-01-19	2016-07-27	Mk电子株式会社	接合线

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5614650U (fr) *	1979-07-14	1981-02-07
JPS56169341A (en) *	1980-05-31	1981-12-26	Tanaka Kikinzoku Kogyo Kk	Bonding wire for semiconductor element
US6711925B2 (en) *	2001-12-17	2004-03-30	Asep Tec Co., Ltd.	Process for manufacturing a conductive wire suitable for use in semiconductor packages
EP2822029B1 (fr)	2012-02-27	2024-12-18	Nippon Micrometal Corporation	Fil de connexion
CN105393343A (zh)	2014-01-31	2016-03-09	大自达电线株式会社	线键合及其制造方法

1975
- 1975-01-27 JP JP1052575A patent/JPS5423794B2/ja not_active Expired

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN105810652A (zh) *	2015-01-19	2016-07-27	Mk电子株式会社	接合线

Also Published As

Publication number	Publication date
JPS5185669A (fr)	1976-07-27

Publication	Publication Date	Title
FR2312857B1 (fr)	1978-11-17
JPS5185669A (fr)	1976-07-27
JPS52595U (fr)	1977-01-05
FR2333224B1 (fr)	1981-08-21
JPS51109513U (fr)	1976-09-03
JPS5749656Y2 (fr)	1982-10-30
JPS557355Y2 (fr)	1980-02-19
FR2322295B1 (fr)	1981-09-25
JPS5647075B2 (fr)	1981-11-07
JPS5283925U (fr)	1977-06-22
JPS5253082U (fr)	1977-04-15
JPS543150Y2 (fr)	1979-02-13
JPS5511582Y2 (fr)	1980-03-13
JPS5532215Y2 (fr)	1980-07-31
JPS5554224Y2 (fr)	1980-12-15
JPS5228434U (fr)	1977-02-28
JPS51140110U (fr)	1976-11-11
JPS51138396U (fr)	1976-11-08
JPS51117837U (fr)	1976-09-24
JPS51111279U (fr)	1976-09-08
JPS51154073U (fr)	1976-12-08
JPS51104079U (fr)	1976-08-20
JPS5197588U (fr)	1976-08-05
JPS5222807U (fr)	1977-02-17
CH609644A5 (fr)	1979-03-15

JPS5423794B2 - - Google Patents

Info

Links

Classifications

Landscapes

Priority Applications (1)

Applications Claiming Priority (1)

Publications (2)

Family

ID=11752652

Family Applications (1)

Country Status (1)

Cited By (1)

Families Citing this family (5)

Cited By (1)

Also Published As

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