JPS542669A - Monitoring method for pattern formed on semiconductor wafer - Google Patents

Monitoring method for pattern formed on semiconductor wafer

Info

Publication number
JPS542669A
JPS542669A JP6822177A JP6822177A JPS542669A JP S542669 A JPS542669 A JP S542669A JP 6822177 A JP6822177 A JP 6822177A JP 6822177 A JP6822177 A JP 6822177A JP S542669 A JPS542669 A JP S542669A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
pattern formed
monitoring method
pattern
technic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6822177A
Other languages
Japanese (ja)
Other versions
JPS597218B2 (en
Inventor
Hirozo Takano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP52068221A priority Critical patent/JPS597218B2/en
Publication of JPS542669A publication Critical patent/JPS542669A/en
Publication of JPS597218B2 publication Critical patent/JPS597218B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Weting (AREA)

Abstract

PURPOSE: To inspect a pattern defect accurately with high precision by using an inspection device which is applied with pattern recognition technic, by forming the same patterns on a transparent monitoring wafer in one manufacture process.
COPYRIGHT: (C)1979,JPO&Japio
JP52068221A 1977-06-08 1977-06-08 Method for monitoring patterns formed on semiconductor wafers Expired JPS597218B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52068221A JPS597218B2 (en) 1977-06-08 1977-06-08 Method for monitoring patterns formed on semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52068221A JPS597218B2 (en) 1977-06-08 1977-06-08 Method for monitoring patterns formed on semiconductor wafers

Publications (2)

Publication Number Publication Date
JPS542669A true JPS542669A (en) 1979-01-10
JPS597218B2 JPS597218B2 (en) 1984-02-17

Family

ID=13367525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52068221A Expired JPS597218B2 (en) 1977-06-08 1977-06-08 Method for monitoring patterns formed on semiconductor wafers

Country Status (1)

Country Link
JP (1) JPS597218B2 (en)

Also Published As

Publication number Publication date
JPS597218B2 (en) 1984-02-17

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