JPS542685A - Forming method for metal wiring - Google Patents

Forming method for metal wiring

Info

Publication number
JPS542685A
JPS542685A JP6827877A JP6827877A JPS542685A JP S542685 A JPS542685 A JP S542685A JP 6827877 A JP6827877 A JP 6827877A JP 6827877 A JP6827877 A JP 6827877A JP S542685 A JPS542685 A JP S542685A
Authority
JP
Japan
Prior art keywords
forming method
metal wiring
pattern
vapor
metal film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6827877A
Other languages
Japanese (ja)
Inventor
Kenzo Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6827877A priority Critical patent/JPS542685A/en
Publication of JPS542685A publication Critical patent/JPS542685A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Circuit Boards (AREA)
  • Weting (AREA)

Abstract

PURPOSE: To obtain fine-pattern metal wirings accurately, by vapor-depositing a metal film on the entire surface after providing a photosensitizer pattern onto the substrate and by removing the photosensitizer pattern and the vapor-deposited metal film together.
COPYRIGHT: (C)1979,JPO&Japio
JP6827877A 1977-06-08 1977-06-08 Forming method for metal wiring Pending JPS542685A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6827877A JPS542685A (en) 1977-06-08 1977-06-08 Forming method for metal wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6827877A JPS542685A (en) 1977-06-08 1977-06-08 Forming method for metal wiring

Publications (1)

Publication Number Publication Date
JPS542685A true JPS542685A (en) 1979-01-10

Family

ID=13369124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6827877A Pending JPS542685A (en) 1977-06-08 1977-06-08 Forming method for metal wiring

Country Status (1)

Country Link
JP (1) JPS542685A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58202546A (en) * 1982-05-21 1983-11-25 Mitsubishi Electric Corp Formation of element isolation film
JPS59215790A (en) * 1983-05-23 1984-12-05 マルイ工業株式会社 Method of producing printed circuit board
JPS62171169A (en) * 1986-01-23 1987-07-28 Kanegafuchi Chem Ind Co Ltd Method manufacture for thin film pattern
JP2007059520A (en) * 2005-08-23 2007-03-08 Iwate Univ Microfabrication method, microfabrication structure, electronic device manufacturing method, and electronic device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58202546A (en) * 1982-05-21 1983-11-25 Mitsubishi Electric Corp Formation of element isolation film
JPS59215790A (en) * 1983-05-23 1984-12-05 マルイ工業株式会社 Method of producing printed circuit board
JPS62171169A (en) * 1986-01-23 1987-07-28 Kanegafuchi Chem Ind Co Ltd Method manufacture for thin film pattern
JP2007059520A (en) * 2005-08-23 2007-03-08 Iwate Univ Microfabrication method, microfabrication structure, electronic device manufacturing method, and electronic device

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