JPS5426879A - Encapsulated electronic part - Google Patents

Encapsulated electronic part

Info

Publication number
JPS5426879A
JPS5426879A JP9279977A JP9279977A JPS5426879A JP S5426879 A JPS5426879 A JP S5426879A JP 9279977 A JP9279977 A JP 9279977A JP 9279977 A JP9279977 A JP 9279977A JP S5426879 A JPS5426879 A JP S5426879A
Authority
JP
Japan
Prior art keywords
electronic part
encapsulated electronic
uncured
bulging
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9279977A
Other languages
Japanese (ja)
Other versions
JPS5526971B2 (en
Inventor
Katsumi Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP9279977A priority Critical patent/JPS5426879A/en
Publication of JPS5426879A publication Critical patent/JPS5426879A/en
Publication of JPS5526971B2 publication Critical patent/JPS5526971B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Laminated Bodies (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To prepare an encapsulated electronic part having high mechanical strength while preventing the bulging of the center of the part after melt curing, by bonding a piece of sheet to a surface of a tablet made of an uncured heatcurable resin composition.
COPYRIGHT: (C)1979,JPO&Japio
JP9279977A 1977-08-01 1977-08-01 Encapsulated electronic part Granted JPS5426879A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9279977A JPS5426879A (en) 1977-08-01 1977-08-01 Encapsulated electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9279977A JPS5426879A (en) 1977-08-01 1977-08-01 Encapsulated electronic part

Publications (2)

Publication Number Publication Date
JPS5426879A true JPS5426879A (en) 1979-02-28
JPS5526971B2 JPS5526971B2 (en) 1980-07-17

Family

ID=14064455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9279977A Granted JPS5426879A (en) 1977-08-01 1977-08-01 Encapsulated electronic part

Country Status (1)

Country Link
JP (1) JPS5426879A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997031394A1 (en) * 1996-02-22 1997-08-28 Nitto Denko Corporation Semiconductor device and method for manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5260748U (en) * 1975-10-31 1977-05-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5260748U (en) * 1975-10-31 1977-05-04

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997031394A1 (en) * 1996-02-22 1997-08-28 Nitto Denko Corporation Semiconductor device and method for manufacturing the same
US6144108A (en) * 1996-02-22 2000-11-07 Nitto Denko Corporation Semiconductor device and method of fabricating the same

Also Published As

Publication number Publication date
JPS5526971B2 (en) 1980-07-17

Similar Documents

Publication Publication Date Title
JPS5253663A (en) Resin sealing mold
JPS5236141A (en) Process for manufacturing mica-thermoplastic resin composite materials
JPS5426879A (en) Encapsulated electronic part
JPS53112958A (en) Laminated resin molded article and its preparation
JPS5219755A (en) Epoxy novolak resin production method
JPS5211245A (en) Phenolic resin composition
JPS53133371A (en) Lead frame of plastic package for integrated circuit
JPS5430798A (en) Manufacture of luminous display element
JPS5277738A (en) Production of plastic lenticular lens
JPS5275180A (en) Package for integrated circuits
JPS5380000A (en) Process for curing epoxy compound
JPS5313239A (en) Manufacturing process of laminated electrical heat plate
JPS524600A (en) Curing of epoxy resin
JPS5284752A (en) Preparation of optical part which uses as matrix cured adhesives
JPS5274155A (en) Heat insulation molding plate
JPS51132264A (en) A moulding material of thermosetting resin
JPS5387173A (en) Molding mold
JPS5219851A (en) Method of fitting parts
JPS53133247A (en) Formation of resin film
JPS5247100A (en) Epoxy resin compositions having good wet adhesiveness
JPS5413923A (en) Preparing coil
JPS5423659A (en) Encapsulation with resin
JPS51147548A (en) Process for manufacturing thermosetting resin molding materials
JPS53130757A (en) Mold for molding resins
JPS5216560A (en) Degassing of polyurethane resin