JPS5429343B2 - - Google Patents
Info
- Publication number
- JPS5429343B2 JPS5429343B2 JP8505375A JP8505375A JPS5429343B2 JP S5429343 B2 JPS5429343 B2 JP S5429343B2 JP 8505375 A JP8505375 A JP 8505375A JP 8505375 A JP8505375 A JP 8505375A JP S5429343 B2 JPS5429343 B2 JP S5429343B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50085053A JPS528774A (en) | 1975-07-10 | 1975-07-10 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50085053A JPS528774A (en) | 1975-07-10 | 1975-07-10 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS528774A JPS528774A (en) | 1977-01-22 |
| JPS5429343B2 true JPS5429343B2 (2) | 1979-09-22 |
Family
ID=13847902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50085053A Granted JPS528774A (en) | 1975-07-10 | 1975-07-10 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS528774A (2) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4501646A (en) * | 1984-06-25 | 1985-02-26 | Xerox Corporation | Electroforming process |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5130295B2 (2) * | 1971-08-25 | 1976-08-31 | ||
| JPS4940271U (2) * | 1972-07-06 | 1974-04-09 |
-
1975
- 1975-07-10 JP JP50085053A patent/JPS528774A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS528774A (en) | 1977-01-22 |