JPS5429564A - Stem for semiconductor device - Google Patents

Stem for semiconductor device

Info

Publication number
JPS5429564A
JPS5429564A JP9501977A JP9501977A JPS5429564A JP S5429564 A JPS5429564 A JP S5429564A JP 9501977 A JP9501977 A JP 9501977A JP 9501977 A JP9501977 A JP 9501977A JP S5429564 A JPS5429564 A JP S5429564A
Authority
JP
Japan
Prior art keywords
stem
semiconductor device
pellet
scaling
enclosing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9501977A
Other languages
Japanese (ja)
Inventor
Kenji Akeyama
Hirokazu Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9501977A priority Critical patent/JPS5429564A/en
Publication of JPS5429564A publication Critical patent/JPS5429564A/en
Pending legal-status Critical Current

Links

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  • Die Bonding (AREA)

Abstract

PURPOSE: To decrease the stress caused between the pellet and the stem and to avoid the occurrence of scaling, by enclosing the semiconductor element pellet mounting region with the ring consisting of Mo, W or their alloy having smaller thermal expansion coefficient.
COPYRIGHT: (C)1979,JPO&Japio
JP9501977A 1977-08-10 1977-08-10 Stem for semiconductor device Pending JPS5429564A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9501977A JPS5429564A (en) 1977-08-10 1977-08-10 Stem for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9501977A JPS5429564A (en) 1977-08-10 1977-08-10 Stem for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5429564A true JPS5429564A (en) 1979-03-05

Family

ID=14126322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9501977A Pending JPS5429564A (en) 1977-08-10 1977-08-10 Stem for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5429564A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0289601A (en) * 1988-09-27 1990-03-29 Sumitomo Ringyo Kk Manufacture of composite wooden material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0289601A (en) * 1988-09-27 1990-03-29 Sumitomo Ringyo Kk Manufacture of composite wooden material

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