JPS543270A - Method of making ceramic multiilayer wired substrate - Google Patents
Method of making ceramic multiilayer wired substrateInfo
- Publication number
- JPS543270A JPS543270A JP6758277A JP6758277A JPS543270A JP S543270 A JPS543270 A JP S543270A JP 6758277 A JP6758277 A JP 6758277A JP 6758277 A JP6758277 A JP 6758277A JP S543270 A JPS543270 A JP S543270A
- Authority
- JP
- Japan
- Prior art keywords
- multiilayer
- making ceramic
- wired substrate
- wired
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6758277A JPS543270A (en) | 1977-06-08 | 1977-06-08 | Method of making ceramic multiilayer wired substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6758277A JPS543270A (en) | 1977-06-08 | 1977-06-08 | Method of making ceramic multiilayer wired substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS543270A true JPS543270A (en) | 1979-01-11 |
Family
ID=13349050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6758277A Pending JPS543270A (en) | 1977-06-08 | 1977-06-08 | Method of making ceramic multiilayer wired substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS543270A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4783358A (en) * | 1986-02-14 | 1988-11-08 | Nec Corporation | Ceramic wiring substrate |
| US5329695A (en) * | 1992-09-01 | 1994-07-19 | Rogers Corporation | Method of manufacturing a multilayer circuit board |
| JP2009239066A (en) * | 2008-03-27 | 2009-10-15 | Kyocera Corp | Ceramic substrate, and manufacturing method therefor |
| JPWO2018180744A1 (en) * | 2017-03-27 | 2019-11-07 | 株式会社村田製作所 | Conductor connection structure, electronic component, method for manufacturing conductor connection structure, and method for manufacturing electronic component |
-
1977
- 1977-06-08 JP JP6758277A patent/JPS543270A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4783358A (en) * | 1986-02-14 | 1988-11-08 | Nec Corporation | Ceramic wiring substrate |
| US5329695A (en) * | 1992-09-01 | 1994-07-19 | Rogers Corporation | Method of manufacturing a multilayer circuit board |
| JP2009239066A (en) * | 2008-03-27 | 2009-10-15 | Kyocera Corp | Ceramic substrate, and manufacturing method therefor |
| JPWO2018180744A1 (en) * | 2017-03-27 | 2019-11-07 | 株式会社村田製作所 | Conductor connection structure, electronic component, method for manufacturing conductor connection structure, and method for manufacturing electronic component |
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