JPS5433247A - Metal bonding method - Google Patents

Metal bonding method

Info

Publication number
JPS5433247A
JPS5433247A JP9922277A JP9922277A JPS5433247A JP S5433247 A JPS5433247 A JP S5433247A JP 9922277 A JP9922277 A JP 9922277A JP 9922277 A JP9922277 A JP 9922277A JP S5433247 A JPS5433247 A JP S5433247A
Authority
JP
Japan
Prior art keywords
bonding method
metal bonding
bonding
metals
improvement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9922277A
Other languages
Japanese (ja)
Inventor
Osamu Yasutome
Katsuomi Hira
Takeshi Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9922277A priority Critical patent/JPS5433247A/en
Publication of JPS5433247A publication Critical patent/JPS5433247A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/16—Resistance welding; Severing by resistance heating taking account of the properties of the material to be welded

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

PURPOSE:To achieve the improvement in bonding efficiency and improvement in quality by pressing the desired bonding position of metals formed with insulation films with dies and beforehand removing the insulation films then bonding the metals at the time of bonding two kinds of metals.
JP9922277A 1977-08-19 1977-08-19 Metal bonding method Pending JPS5433247A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9922277A JPS5433247A (en) 1977-08-19 1977-08-19 Metal bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9922277A JPS5433247A (en) 1977-08-19 1977-08-19 Metal bonding method

Publications (1)

Publication Number Publication Date
JPS5433247A true JPS5433247A (en) 1979-03-10

Family

ID=14241624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9922277A Pending JPS5433247A (en) 1977-08-19 1977-08-19 Metal bonding method

Country Status (1)

Country Link
JP (1) JPS5433247A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014007881A (en) * 2012-06-26 2014-01-16 Canon Precision Inc Vibration type drive device
JP2014065930A (en) * 2012-09-24 2014-04-17 Dainippon Printing Co Ltd Vapor deposition mask material, and vapor deposition mask material fixing method
JP2016211080A (en) * 2016-09-08 2016-12-15 大日本印刷株式会社 Vapor deposition mask material, vapor deposition mask material fixing method, and organic semiconductor element manufacturing method
JP2017179610A (en) * 2017-06-28 2017-10-05 大日本印刷株式会社 Vapor deposition mask material, vapor deposition mask material fixing method, organic semiconductor element manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014007881A (en) * 2012-06-26 2014-01-16 Canon Precision Inc Vibration type drive device
JP2014065930A (en) * 2012-09-24 2014-04-17 Dainippon Printing Co Ltd Vapor deposition mask material, and vapor deposition mask material fixing method
JP2016211080A (en) * 2016-09-08 2016-12-15 大日本印刷株式会社 Vapor deposition mask material, vapor deposition mask material fixing method, and organic semiconductor element manufacturing method
JP2017179610A (en) * 2017-06-28 2017-10-05 大日本印刷株式会社 Vapor deposition mask material, vapor deposition mask material fixing method, organic semiconductor element manufacturing method

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