JPS5434669B2 - - Google Patents

Info

Publication number: JPS5434669B2
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP753626A

Other languages

Japanese (ja)

Other versions

JPS5178174A (2

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1974-12-27

Filing date

1974-12-27

Publication date

1979-10-29

1974-12-27 Application filed filed Critical

1974-12-27 Priority to JP753626A priority Critical patent/JPS5434669B2/ja

1976-07-07 Publication of JPS5178174A publication Critical patent/JPS5178174A/ja

1979-10-29 Publication of JPS5434669B2 publication Critical patent/JPS5434669B2/ja

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07521—Aligning
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Wire Bonding (AREA)

JP753626A 1974-12-27 1974-12-27 Expired JPS5434669B2 (2)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP753626A JPS5434669B2 (2)	1974-12-27	1974-12-27

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP753626A JPS5434669B2 (2)	1974-12-27	1974-12-27

Related Child Applications (1)

Application Number	Title	Priority Date	Filing Date
JP56063340A Division JPS5771141A (en)	1981-04-28	1981-04-28	Ultrasonic wire bonding for semiconductor

Publications (2)

Publication Number	Publication Date
JPS5178174A JPS5178174A (2)	1976-07-07
JPS5434669B2 true JPS5434669B2 (2)	1979-10-29

Family

ID=11562694

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP753626A Expired JPS5434669B2 (2)	1974-12-27	1974-12-27

Country Status (1)

Country	Link
JP (1)	JPS5434669B2 (2)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6125258Y2 (2) *	1980-08-20	1986-07-29
US4759073A (en) *	1985-11-15	1988-07-19	Kulicke & Soffa Industries, Inc.	Bonding apparatus with means and method for automatic calibration using pattern recognition
JP3101854B2 (ja) *	1994-04-27	2000-10-23	株式会社新川	ワイヤボンデイング装置
JP3235008B2 (ja) *	1994-07-16	2001-12-04	株式会社新川	ワイヤボンデイング部のボール検出方法及び検出装置

1974
- 1974-12-27 JP JP753626A patent/JPS5434669B2/ja not_active Expired

Also Published As

Publication number	Publication date
JPS5178174A (2)	1976-07-07

Publication	Publication Date	Title
DK139166C (2)	1979-06-05
BR7501663A (2)	1975-12-23
FI753270A7 (2)	1976-05-29
DK136328C (2)	1978-02-27
DK141352C (2)	1980-09-01
DK140222C (2)	1979-12-03
JPS5178174A (2)	1976-07-07
AU7459574A (2)	1976-04-29
AU495821B2 (2)	1976-10-07
AU485022B2 (2)	1977-01-06
FI46874A7 (2)	1975-08-20
DK139076A (2)	1976-10-23
AU7465674A (2)	1976-04-29
AU7465874A (2)	1976-04-29
AU8191875A (2)	1976-12-09
DK160875A (2)	1975-10-17
CS163686B1 (2)	1975-09-15
FI297174A7 (2)	1976-04-12
BG20440A1 (2)	1975-12-05
BG19946A1 (2)	1975-10-30
CH577791A5 (2)	1976-07-30
CH573136B5 (2)	1976-02-27
CH588181A5 (2)	1977-05-31
BG20455A1 (2)	1975-12-05
CH590667A5 (2)	1977-08-15