Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Japan Atomic Energy Agency
Original Assignee
Japan Atomic Energy Research Institute
Mitsubishi Plastics Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Atomic Energy Research Institute, Mitsubishi Plastics Industries LtdfiledCriticalJapan Atomic Energy Research Institute
Priority to JP10407377ApriorityCriticalpatent/JPS5437173A/en
Publication of JPS5437173ApublicationCriticalpatent/JPS5437173A/en
PURPOSE: The face to be bonded of molded products are irradiated with ionic radiation and coated with an adhesive of unsaturated polyester resin to conduct bonding in good operation giving film adhesion without sanding the surface to be bonded.
COPYRIGHT: (C)1979,JPO&Japio
JP10407377A1977-08-301977-08-30Method of bonding frp
PendingJPS5437173A
(en)
APPARATUS FOR DEBURRING PUNCHED BLANKS OF PLASTIC INCLUDING THERMOSETTING PLASTIC AND INTENDED FOR USE IN CONNECTION WITH ONE OR MORE PRESSES FOR THE MANUFACTURE OF SAID PLASTIC BLANKS