JPS5447571A - Electronic parts - Google Patents

Electronic parts

Info

Publication number
JPS5447571A
JPS5447571A JP11335477A JP11335477A JPS5447571A JP S5447571 A JPS5447571 A JP S5447571A JP 11335477 A JP11335477 A JP 11335477A JP 11335477 A JP11335477 A JP 11335477A JP S5447571 A JPS5447571 A JP S5447571A
Authority
JP
Japan
Prior art keywords
leads
films
chip
tape carrier
surface opposite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11335477A
Other languages
Japanese (ja)
Inventor
Yoshio Adachi
Hajime Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11335477A priority Critical patent/JPS5447571A/en
Publication of JPS5447571A publication Critical patent/JPS5447571A/en
Pending legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To improve bondability by securing the electrodes of a semiconductor element pellet on the surface opposite from the surface where polymide films of finger leads constituting a tape carrier are deposited and resin-sealing the pellet and the leads in its neighborhood.
CONSTITUTION: Polymide films 11 are laminated on the finger leads 12 of an electrolytic copper foil being the structural parts of a tape carrier and the pad electrodes 14 provided to an IC chip 13 are bonded on the surface opposite therefrom. Thereafter, the chip 13 is sealed with resins 15 and 16, perfectly enclosing the same and including the leads 12 and the ends of the films. If the device is formed in this way, there is no possibility for producing voids in the bonding face, the bondability improves and the degree of freedom in package design increases
COPYRIGHT: (C)1979,JPO&Japio
JP11335477A 1977-09-22 1977-09-22 Electronic parts Pending JPS5447571A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11335477A JPS5447571A (en) 1977-09-22 1977-09-22 Electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11335477A JPS5447571A (en) 1977-09-22 1977-09-22 Electronic parts

Publications (1)

Publication Number Publication Date
JPS5447571A true JPS5447571A (en) 1979-04-14

Family

ID=14610133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11335477A Pending JPS5447571A (en) 1977-09-22 1977-09-22 Electronic parts

Country Status (1)

Country Link
JP (1) JPS5447571A (en)

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