JPS5448486A - Automatic measuring unit - Google Patents

Automatic measuring unit

Info

Publication number
JPS5448486A
JPS5448486A JP11577977A JP11577977A JPS5448486A JP S5448486 A JPS5448486 A JP S5448486A JP 11577977 A JP11577977 A JP 11577977A JP 11577977 A JP11577977 A JP 11577977A JP S5448486 A JPS5448486 A JP S5448486A
Authority
JP
Japan
Prior art keywords
needle
measured material
measuring
measuring needle
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11577977A
Other languages
Japanese (ja)
Inventor
Ryukichi Matsumura
Kazumi Tanaka
Tatsuyuki Tomioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11577977A priority Critical patent/JPS5448486A/en
Publication of JPS5448486A publication Critical patent/JPS5448486A/en
Pending legal-status Critical Current

Links

Landscapes

  • A Measuring Device Byusing Mechanical Method (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

PURPOSE: To avoid the damage to the measuring needle, by performing accurate measurement, through contacting the measuring needle to the measured object with a given amount of contactness even if there is bend and waving on the measured material, by automatically adjusting the upper and lower amount of shift of the upper and lower set along the surface shape of the measured material.
CONSTITUTION: The probe card 13 is constituted with 16 pairs of measuring needle 11 and the position detecting needle 12. At this tmie, the measuring needles 11 and 12 are placed with the tips close each other, and the detection needle 12 is projected slightly lower than the measuring needle 11. The switch function is given to the detection needle 12 and constitution is made that electric signal is outputted when this is in contact with the measured material. Next, the card 13 is mounted under the up and lower set 3 placed on the measring main body, and the detection needle 12 is cntacted with the measured material 1 placed on the fine feed set 2. After that, the output information from the needle 12 lowers the set 3 further, and the measuring needle 11 is contacted with the measured material 1 and measurement is made
COPYRIGHT: (C)1979,JPO&Japio
JP11577977A 1977-09-26 1977-09-26 Automatic measuring unit Pending JPS5448486A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11577977A JPS5448486A (en) 1977-09-26 1977-09-26 Automatic measuring unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11577977A JPS5448486A (en) 1977-09-26 1977-09-26 Automatic measuring unit

Publications (1)

Publication Number Publication Date
JPS5448486A true JPS5448486A (en) 1979-04-17

Family

ID=14670839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11577977A Pending JPS5448486A (en) 1977-09-26 1977-09-26 Automatic measuring unit

Country Status (1)

Country Link
JP (1) JPS5448486A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63107038A (en) * 1981-11-02 1988-05-12 ジヨセフ　クバトロニツク Miniature circuit processing device
JPH02290035A (en) * 1989-11-30 1990-11-29 Tokyo Electron Ltd Semiconductor wafer measuring equipment

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4845179A (en) * 1971-06-25 1973-06-28
JPS5178692A (en) * 1974-12-29 1976-07-08 Sony Corp

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4845179A (en) * 1971-06-25 1973-06-28
JPS5178692A (en) * 1974-12-29 1976-07-08 Sony Corp

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63107038A (en) * 1981-11-02 1988-05-12 ジヨセフ　クバトロニツク Miniature circuit processing device
JPH02290035A (en) * 1989-11-30 1990-11-29 Tokyo Electron Ltd Semiconductor wafer measuring equipment

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