JPS5449070A - Container for semiconductor device - Google Patents

Container for semiconductor device

Info

Publication number
JPS5449070A
JPS5449070A JP11584377A JP11584377A JPS5449070A JP S5449070 A JPS5449070 A JP S5449070A JP 11584377 A JP11584377 A JP 11584377A JP 11584377 A JP11584377 A JP 11584377A JP S5449070 A JPS5449070 A JP S5449070A
Authority
JP
Japan
Prior art keywords
container
connection
external
terminal
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11584377A
Other languages
Japanese (ja)
Other versions
JPS617024B2 (en
Inventor
Takaaki Kitada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11584377A priority Critical patent/JPS5449070A/en
Publication of JPS5449070A publication Critical patent/JPS5449070A/en
Publication of JPS617024B2 publication Critical patent/JPS617024B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07553—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To improve element characteristics in a high-frequency range with the floating capacity of a container reduced, by forming a ceramic container, in which a semiconductor element is installed, in a concave shape, by providing a leadout wire connection part to its flank top surface, and by sealing the it with a cap used for an external leadout terminal in common.
CONSTITUTION: Container 18 is formed of ceramic into a concave shape, and on its bottom part, external lead-out terminal plates 14 and 15 connected to external connection terminals 11 and 12 are arranged confronting each other while penetrating the wall of container 18. Onto terminal plate 14, transistor element piece 13 is anchored with its collector made in contact, and the base is connected to terminal plate 15 by connection wire 17. Further, the emitter of element piece 13 is fitted by using connection wire 16 to external lead-out connection part 10 combinationally used for the sealing surface adhered to the top surface of the flank of container 18 nearly as high as element piece 13. In this way, emitter connection wire 16 is shortened to reduce the floating capacity; and then, the cap combinationally used as external connection terminal is sealed after putting it on the container 18.
COPYRIGHT: (C)1979,JPO&Japio
JP11584377A 1977-09-26 1977-09-26 Container for semiconductor device Granted JPS5449070A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11584377A JPS5449070A (en) 1977-09-26 1977-09-26 Container for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11584377A JPS5449070A (en) 1977-09-26 1977-09-26 Container for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5449070A true JPS5449070A (en) 1979-04-18
JPS617024B2 JPS617024B2 (en) 1986-03-03

Family

ID=14672493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11584377A Granted JPS5449070A (en) 1977-09-26 1977-09-26 Container for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5449070A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57162451A (en) * 1981-03-31 1982-10-06 Fujitsu Ltd Semiconductor device
JP2008074607A (en) * 2006-09-25 2008-04-03 Kato Works Co Ltd Crane overwinding detection device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100401627B1 (en) * 2000-12-30 2003-10-17 현대자동차주식회사 Cam type piercing press system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57162451A (en) * 1981-03-31 1982-10-06 Fujitsu Ltd Semiconductor device
JP2008074607A (en) * 2006-09-25 2008-04-03 Kato Works Co Ltd Crane overwinding detection device

Also Published As

Publication number Publication date
JPS617024B2 (en) 1986-03-03

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