JPS5458795A - Preparation of curing agent for epoxy resin - Google Patents

Preparation of curing agent for epoxy resin

Info

Publication number
JPS5458795A
JPS5458795A JP12445477A JP12445477A JPS5458795A JP S5458795 A JPS5458795 A JP S5458795A JP 12445477 A JP12445477 A JP 12445477A JP 12445477 A JP12445477 A JP 12445477A JP S5458795 A JPS5458795 A JP S5458795A
Authority
JP
Japan
Prior art keywords
curing agent
novolak
affording
heating
phenolic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12445477A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5645491B2 (de
Inventor
Masahiro Kitamura
Hiroshi Suzuki
Takashi Urano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP12445477A priority Critical patent/JPS5458795A/ja
Publication of JPS5458795A publication Critical patent/JPS5458795A/ja
Publication of JPS5645491B2 publication Critical patent/JPS5645491B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Epoxy Resins (AREA)
JP12445477A 1977-10-19 1977-10-19 Preparation of curing agent for epoxy resin Granted JPS5458795A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12445477A JPS5458795A (en) 1977-10-19 1977-10-19 Preparation of curing agent for epoxy resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12445477A JPS5458795A (en) 1977-10-19 1977-10-19 Preparation of curing agent for epoxy resin

Publications (2)

Publication Number Publication Date
JPS5458795A true JPS5458795A (en) 1979-05-11
JPS5645491B2 JPS5645491B2 (de) 1981-10-27

Family

ID=14885911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12445477A Granted JPS5458795A (en) 1977-10-19 1977-10-19 Preparation of curing agent for epoxy resin

Country Status (1)

Country Link
JP (1) JPS5458795A (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5387329A (en) * 1977-01-10 1978-08-01 Sumitomo Chem Co Ltd Preparation of hydroperoxide
JPS56112924A (en) * 1980-02-13 1981-09-05 Matsushita Electric Works Ltd Epoxy resin composition
JPS57109642A (en) * 1980-12-27 1982-07-08 Toshiba Chem Prod Copper plated laminated board
JPS5967660A (ja) * 1982-10-12 1984-04-17 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置
JP2001348488A (ja) * 2000-06-06 2001-12-18 Matsushita Electric Works Ltd 熱伝導性樹脂組成物、プリプレグ、放熱性回路基板及び放熱性発熱部品
US6664344B1 (en) * 1999-07-22 2003-12-16 Sumitomo Bakelite Company Limited Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100586763B1 (ko) 1998-07-02 2006-06-08 신에쓰 가가꾸 고교 가부시끼가이샤 포스포늄보레이트 화합물, 그의 제조방법, 에폭시 수지 조성물용경화 촉매 및 에폭시 수지 조성물
JP4452071B2 (ja) 2003-12-04 2010-04-21 日東電工株式会社 半導体封止用エポキシ樹脂組成物の製法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5387329A (en) * 1977-01-10 1978-08-01 Sumitomo Chem Co Ltd Preparation of hydroperoxide
JPS56112924A (en) * 1980-02-13 1981-09-05 Matsushita Electric Works Ltd Epoxy resin composition
JPS57109642A (en) * 1980-12-27 1982-07-08 Toshiba Chem Prod Copper plated laminated board
JPS5967660A (ja) * 1982-10-12 1984-04-17 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置
US6664344B1 (en) * 1999-07-22 2003-12-16 Sumitomo Bakelite Company Limited Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product
JP2001348488A (ja) * 2000-06-06 2001-12-18 Matsushita Electric Works Ltd 熱伝導性樹脂組成物、プリプレグ、放熱性回路基板及び放熱性発熱部品

Also Published As

Publication number Publication date
JPS5645491B2 (de) 1981-10-27

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