JPS5458870A - Method of molding mold of electronic device - Google Patents

Method of molding mold of electronic device

Info

Publication number
JPS5458870A
JPS5458870A JP12560977A JP12560977A JPS5458870A JP S5458870 A JPS5458870 A JP S5458870A JP 12560977 A JP12560977 A JP 12560977A JP 12560977 A JP12560977 A JP 12560977A JP S5458870 A JPS5458870 A JP S5458870A
Authority
JP
Japan
Prior art keywords
electronic device
molding mold
mold
molding
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12560977A
Other languages
Japanese (ja)
Other versions
JPS5620703B2 (en
Inventor
Hiroyuki Nishi
Masabumi Tsunetsugu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP12560977A priority Critical patent/JPS5458870A/en
Publication of JPS5458870A publication Critical patent/JPS5458870A/en
Publication of JPS5620703B2 publication Critical patent/JPS5620703B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP12560977A 1977-10-18 1977-10-18 Method of molding mold of electronic device Granted JPS5458870A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12560977A JPS5458870A (en) 1977-10-18 1977-10-18 Method of molding mold of electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12560977A JPS5458870A (en) 1977-10-18 1977-10-18 Method of molding mold of electronic device

Publications (2)

Publication Number Publication Date
JPS5458870A true JPS5458870A (en) 1979-05-11
JPS5620703B2 JPS5620703B2 (en) 1981-05-15

Family

ID=14914332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12560977A Granted JPS5458870A (en) 1977-10-18 1977-10-18 Method of molding mold of electronic device

Country Status (1)

Country Link
JP (1) JPS5458870A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099591U (en) * 1983-12-12 1985-07-06 株式会社　指月電機製作所 circuit unit
JPS60172374U (en) * 1984-04-23 1985-11-15 株式会社　指月電機製作所 circuit unit
JPS633021U (en) * 1986-06-25 1988-01-09

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48140U (en) * 1971-05-22 1973-01-05
JPS4811348U (en) * 1971-06-18 1973-02-08
JPS5023093U (en) * 1973-06-26 1975-03-14

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48140U (en) * 1971-05-22 1973-01-05
JPS4811348U (en) * 1971-06-18 1973-02-08
JPS5023093U (en) * 1973-06-26 1975-03-14

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099591U (en) * 1983-12-12 1985-07-06 株式会社　指月電機製作所 circuit unit
JPS60172374U (en) * 1984-04-23 1985-11-15 株式会社　指月電機製作所 circuit unit
JPS633021U (en) * 1986-06-25 1988-01-09

Also Published As

Publication number Publication date
JPS5620703B2 (en) 1981-05-15

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