JPS546455A - Dicing method for semiconductor wafer - Google Patents

Dicing method for semiconductor wafer

Info

Publication number
JPS546455A
JPS546455A JP7109177A JP7109177A JPS546455A JP S546455 A JPS546455 A JP S546455A JP 7109177 A JP7109177 A JP 7109177A JP 7109177 A JP7109177 A JP 7109177A JP S546455 A JPS546455 A JP S546455A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
dicing method
dicing
pelletizing
sticking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7109177A
Other languages
Japanese (ja)
Inventor
Tsutomu Mimata
Akira Kabashima
Suguru Ozoegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7109177A priority Critical patent/JPS546455A/en
Publication of JPS546455A publication Critical patent/JPS546455A/en
Pending legal-status Critical Current

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  • Dicing (AREA)

Abstract

PURPOSE: To simplify the handling control by sticking an adhesive sheet to the reverse surface of a substrate and by pelletizing it.
COPYRIGHT: (C)1979,JPO&Japio
JP7109177A 1977-06-17 1977-06-17 Dicing method for semiconductor wafer Pending JPS546455A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7109177A JPS546455A (en) 1977-06-17 1977-06-17 Dicing method for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7109177A JPS546455A (en) 1977-06-17 1977-06-17 Dicing method for semiconductor wafer

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP58222013A Division JPS59130440A (en) 1983-11-28 1983-11-28 Method for separating plates

Publications (1)

Publication Number Publication Date
JPS546455A true JPS546455A (en) 1979-01-18

Family

ID=13450509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7109177A Pending JPS546455A (en) 1977-06-17 1977-06-17 Dicing method for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS546455A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56169332A (en) * 1980-05-31 1981-12-26 Nec Home Electronics Ltd Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56169332A (en) * 1980-05-31 1981-12-26 Nec Home Electronics Ltd Manufacture of semiconductor device

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