JPS5465797A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5465797A
JPS5465797A JP13147877A JP13147877A JPS5465797A JP S5465797 A JPS5465797 A JP S5465797A JP 13147877 A JP13147877 A JP 13147877A JP 13147877 A JP13147877 A JP 13147877A JP S5465797 A JPS5465797 A JP S5465797A
Authority
JP
Japan
Prior art keywords
parts
resin composition
pref
amount
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13147877A
Other languages
Japanese (ja)
Other versions
JPS5952654B2 (en
Inventor
Kuniaki Tobukuro
Sumiko Nagasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP13147877A priority Critical patent/JPS5952654B2/en
Publication of JPS5465797A publication Critical patent/JPS5465797A/en
Publication of JPS5952654B2 publication Critical patent/JPS5952654B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: To provide an epoxy resin composition useful for the preparation of a fiber-reinforced plastic having excellent composite properties and heat resistance, containing tetraglycidyl diaminodiphenyl methane, a urethane-modified epoxy compound, and dicyandiamide.
CONSTITUTION: A resin composition containing (A) tetraglycidyl diaminodiphenyl methane, or its condensate, (B) a urethane-modified epoxy compound, and (C) dicyandiamide. The amount of (B) is pref.3-20% based on (A). When the amount exceeds 20%, the heat resistance of the cured product becomes poor, and when it is less than 3%, the thermal shock resistance of the product cannot be improved. The amount of (A) is pref. 2-10 parts by weight per 100 parts of the resin. Pref. 1.5-8 parts by weight of a cure accelerator such as 3,4-dichlorophenyl-1,1-dimethylurea, is added to 100 parts of the resin.
COPYRIGHT: (C)1979,JPO&Japio
JP13147877A 1977-11-04 1977-11-04 epoxy resin composition Expired JPS5952654B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13147877A JPS5952654B2 (en) 1977-11-04 1977-11-04 epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13147877A JPS5952654B2 (en) 1977-11-04 1977-11-04 epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS5465797A true JPS5465797A (en) 1979-05-26
JPS5952654B2 JPS5952654B2 (en) 1984-12-20

Family

ID=15058906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13147877A Expired JPS5952654B2 (en) 1977-11-04 1977-11-04 epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5952654B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58142955A (en) * 1982-02-19 1983-08-25 Mitsui Petrochem Ind Ltd Adhesive composition
JPS58204073A (en) * 1982-05-21 1983-11-28 Mitsui Petrochem Ind Ltd Adhesive composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58142955A (en) * 1982-02-19 1983-08-25 Mitsui Petrochem Ind Ltd Adhesive composition
JPS58204073A (en) * 1982-05-21 1983-11-28 Mitsui Petrochem Ind Ltd Adhesive composition

Also Published As

Publication number Publication date
JPS5952654B2 (en) 1984-12-20

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