JPS5473900A - Curable resin composition - Google Patents

Curable resin composition

Info

Publication number
JPS5473900A
JPS5473900A JP14124377A JP14124377A JPS5473900A JP S5473900 A JPS5473900 A JP S5473900A JP 14124377 A JP14124377 A JP 14124377A JP 14124377 A JP14124377 A JP 14124377A JP S5473900 A JPS5473900 A JP S5473900A
Authority
JP
Japan
Prior art keywords
prepolymer
component
resin composition
curable resin
amine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14124377A
Other languages
Japanese (ja)
Other versions
JPS5740857B2 (en
Inventor
Morio Take
Nobuyuki Ikeguchi
Kazuyuki Nakamichi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP14124377A priority Critical patent/JPS5473900A/en
Publication of JPS5473900A publication Critical patent/JPS5473900A/en
Publication of JPS5740857B2 publication Critical patent/JPS5740857B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

PURPOSE: The title heat-resistant composition having improved storage stability, curable into an article with a small heat shrinkage, improved mechanical and electrical insulating properties, consisting of a polyfunctional cyanate, a maleimide, and a prepolymer of diallyl phthalate.
CONSTITUTION: A curable resin composition consisting of A) preferably 5W90 wt.% of (a) a polyfunctional cyanate, (b) a prepolymer of the component (a), or (c) a prepolymer of the component (a) with an amine. B) 5W90 wt.% of d) a maleimide shown by the formula (R is di-or polyfunctional organic group; X1 and X2 are H, halogen, alkyl; n is 2W3), e) a prepolymer of the component d, or f, a prepolymer of the component d and an amine, and C) 1W30 wt.% of a prepolymer of diallyl phthalate, and, if necessary, D) an epoxy compound.
COPYRIGHT: (C)1979,JPO&Japio
JP14124377A 1977-11-25 1977-11-25 Curable resin composition Granted JPS5473900A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14124377A JPS5473900A (en) 1977-11-25 1977-11-25 Curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14124377A JPS5473900A (en) 1977-11-25 1977-11-25 Curable resin composition

Publications (2)

Publication Number Publication Date
JPS5473900A true JPS5473900A (en) 1979-06-13
JPS5740857B2 JPS5740857B2 (en) 1982-08-31

Family

ID=15287409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14124377A Granted JPS5473900A (en) 1977-11-25 1977-11-25 Curable resin composition

Country Status (1)

Country Link
JP (1) JPS5473900A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57168944A (en) * 1982-03-15 1982-10-18 Mitsubishi Gas Chem Co Inc Photocurable resin composition
JPS58198562A (en) * 1982-05-13 1983-11-18 Otsuka Chem Co Ltd Heat-resistant composite molding material
JP2010527403A (en) * 2007-05-16 2010-08-12 ダウ グローバル テクノロジーズ インコーポレイティド Flame retardant composition
JP2014503029A (en) * 2011-01-21 2014-02-06 ダウ グローバル テクノロジーズ エルエルシー High performance thermosetting resins useful for electrical laminates, high density interconnects and interconnect substrate applications
EP2660269A4 (en) * 2010-12-27 2014-09-03 Mitsubishi Gas Chemical Co Thermosetting resin composition
CN104877134A (en) * 2015-05-28 2015-09-02 苏州生益科技有限公司 Halogen-free flame-retardant polyimide resin composition and prepreg and laminate made with same
CN109722209A (en) * 2018-12-21 2019-05-07 东华大学 A kind of YASI organic imides silica gel and preparation method thereof
CN109722211A (en) * 2018-12-21 2019-05-07 东华大学 A kind of BDADDM type silicon-containing adhesive and preparation method thereof
CN109722210A (en) * 2018-12-21 2019-05-07 东华大学 A kind of TADE type silicon-containing adhesive and preparation method thereof
CN109722208A (en) * 2018-12-21 2019-05-07 东华大学 A kind of 12BDAPB type silicon-containing adhesive and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5070490A (en) * 1973-10-23 1975-06-11
JPS50129700A (en) * 1974-03-19 1975-10-14
JPS50132099A (en) * 1974-04-08 1975-10-18

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5070490A (en) * 1973-10-23 1975-06-11
JPS50129700A (en) * 1974-03-19 1975-10-14
JPS50132099A (en) * 1974-04-08 1975-10-18

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57168944A (en) * 1982-03-15 1982-10-18 Mitsubishi Gas Chem Co Inc Photocurable resin composition
JPS58198562A (en) * 1982-05-13 1983-11-18 Otsuka Chem Co Ltd Heat-resistant composite molding material
JP2010527403A (en) * 2007-05-16 2010-08-12 ダウ グローバル テクノロジーズ インコーポレイティド Flame retardant composition
EP2660269A4 (en) * 2010-12-27 2014-09-03 Mitsubishi Gas Chemical Co Thermosetting resin composition
JP2014503029A (en) * 2011-01-21 2014-02-06 ダウ グローバル テクノロジーズ エルエルシー High performance thermosetting resins useful for electrical laminates, high density interconnects and interconnect substrate applications
CN104877134A (en) * 2015-05-28 2015-09-02 苏州生益科技有限公司 Halogen-free flame-retardant polyimide resin composition and prepreg and laminate made with same
CN109722209A (en) * 2018-12-21 2019-05-07 东华大学 A kind of YASI organic imides silica gel and preparation method thereof
CN109722211A (en) * 2018-12-21 2019-05-07 东华大学 A kind of BDADDM type silicon-containing adhesive and preparation method thereof
CN109722210A (en) * 2018-12-21 2019-05-07 东华大学 A kind of TADE type silicon-containing adhesive and preparation method thereof
CN109722208A (en) * 2018-12-21 2019-05-07 东华大学 A kind of 12BDAPB type silicon-containing adhesive and preparation method thereof

Also Published As

Publication number Publication date
JPS5740857B2 (en) 1982-08-31

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