JPS5477663A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPS5477663A JPS5477663A JP14471977A JP14471977A JPS5477663A JP S5477663 A JPS5477663 A JP S5477663A JP 14471977 A JP14471977 A JP 14471977A JP 14471977 A JP14471977 A JP 14471977A JP S5477663 A JPS5477663 A JP S5477663A
- Authority
- JP
- Japan
- Prior art keywords
- prepolymer
- resin composition
- curable resin
- trismaleimide
- bismaleimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title abstract 2
- 150000002148 esters Chemical class 0.000 abstract 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 abstract 2
- 229910052582 BN Inorganic materials 0.000 abstract 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 abstract 2
- 239000007795 chemical reaction product Substances 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 229920003192 poly(bis maleimide) Polymers 0.000 abstract 2
- 150000001408 amides Chemical class 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- -1 trismaleimide Chemical compound 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Epoxy Resins (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE: A curable resin composition keeping intrinisic electricla properties of the resin and having high heat conductivity, that is composed of boron nitride, a cyanic ester and a mixture or reaction product of a bismaleimide with a trismaleimide.
CONSTITUTION: To (A) 10 W 80 wt% of boron nitride with an average particle size of 0.5 W 8 microns is added (B) 90 W 20 wt% of a mixture or reaction product from (a) a polyfunctional cyanic ester or its prepolymer or a coprepolymer from a polyfunctional cyanic ester and an amide, (b) bismaleimide, trismaleimide, maleimide prepolymer or prepolymer from maleimide and an amine, (c) an epoxy compound with 2 or more epoxy groups in the molecule and 700 W 6000 epoxy equivalent value.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14471977A JPS5477663A (en) | 1977-12-02 | 1977-12-02 | Curable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14471977A JPS5477663A (en) | 1977-12-02 | 1977-12-02 | Curable resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5477663A true JPS5477663A (en) | 1979-06-21 |
| JPS5610940B2 JPS5610940B2 (en) | 1981-03-11 |
Family
ID=15368704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14471977A Granted JPS5477663A (en) | 1977-12-02 | 1977-12-02 | Curable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5477663A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5726780A (en) * | 1980-07-25 | 1982-02-12 | Casio Comput Co Ltd | Display device |
| JPS61101523A (en) * | 1984-10-25 | 1986-05-20 | Toshiba Chem Corp | Sealing resin composition |
| JP2014503029A (en) * | 2011-01-21 | 2014-02-06 | ダウ グローバル テクノロジーズ エルエルシー | High performance thermosetting resins useful for electrical laminates, high density interconnects and interconnect substrate applications |
| JPWO2018147053A1 (en) * | 2017-02-07 | 2019-02-14 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
| JP2020173945A (en) * | 2019-04-10 | 2020-10-22 | 信越化学工業株式会社 | Low-dielectric heat dissipation film composition and low-dielectric heat dissipation film |
-
1977
- 1977-12-02 JP JP14471977A patent/JPS5477663A/en active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5726780A (en) * | 1980-07-25 | 1982-02-12 | Casio Comput Co Ltd | Display device |
| JPS61101523A (en) * | 1984-10-25 | 1986-05-20 | Toshiba Chem Corp | Sealing resin composition |
| JP2014503029A (en) * | 2011-01-21 | 2014-02-06 | ダウ グローバル テクノロジーズ エルエルシー | High performance thermosetting resins useful for electrical laminates, high density interconnects and interconnect substrate applications |
| JPWO2018147053A1 (en) * | 2017-02-07 | 2019-02-14 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
| JP2020173945A (en) * | 2019-04-10 | 2020-10-22 | 信越化学工業株式会社 | Low-dielectric heat dissipation film composition and low-dielectric heat dissipation film |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5610940B2 (en) | 1981-03-11 |
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