JPS5487061A - Manufacture of electronic parts - Google Patents
Manufacture of electronic partsInfo
- Publication number
- JPS5487061A JPS5487061A JP15364177A JP15364177A JPS5487061A JP S5487061 A JPS5487061 A JP S5487061A JP 15364177 A JP15364177 A JP 15364177A JP 15364177 A JP15364177 A JP 15364177A JP S5487061 A JPS5487061 A JP S5487061A
- Authority
- JP
- Japan
- Prior art keywords
- bar
- main body
- flange
- mold
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000011109 contamination Methods 0.000 abstract 1
- 239000012212 insulator Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Abstract
PURPOSE: To produce the mesh-use with no damage nor contamination by omitting the blanking process for the ultra-thin film and the mesh-use bar.
CONSTITUTION: Insulator cylinder 5 is inserted into the holes of the necessary number provided to the main body mold 4, and then auxiliary mold 6 is inserted with flange 3 of one side ring supported by the auxiliary hole flange. Mesh-use bar 2 is put on to close the hole with extension up to step 41 provided the hole flange of the main body mold from the upper part of the flange of one side ring. Under these conditions, the depth of the main body hole, the height of the auxiliary mold, the thickness of the flange and the depth of the step of the main body mold are decided each so that bar 2 can be put flat. After bar 2 is put on, positioning plate 7 is placed to hold bar 2 at the upper part of the main body mold step, and the ring of other side is placed at the position limited by the plate so that the ring of one side may be opposed to the flange via bar 2. Then bar 2 is welded to both flanges at an optional area, and then an instant conduction is given between the main body mold and the auxiliary mold while plate 7 is being pressed. Thus, bar 2 is fused at the circumferences of both flanges.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15364177A JPS5487061A (en) | 1977-12-22 | 1977-12-22 | Manufacture of electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15364177A JPS5487061A (en) | 1977-12-22 | 1977-12-22 | Manufacture of electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5487061A true JPS5487061A (en) | 1979-07-11 |
Family
ID=15566951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15364177A Pending JPS5487061A (en) | 1977-12-22 | 1977-12-22 | Manufacture of electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5487061A (en) |
-
1977
- 1977-12-22 JP JP15364177A patent/JPS5487061A/en active Pending
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