JPS549672U - - Google Patents
Info
- Publication number
- JPS549672U JPS549672U JP1977082177U JP8217777U JPS549672U JP S549672 U JPS549672 U JP S549672U JP 1977082177 U JP1977082177 U JP 1977082177U JP 8217777 U JP8217777 U JP 8217777U JP S549672 U JPS549672 U JP S549672U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977082177U JPS549672U (2) | 1977-06-21 | 1977-06-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977082177U JPS549672U (2) | 1977-06-21 | 1977-06-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS549672U true JPS549672U (2) | 1979-01-22 |
Family
ID=29002781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977082177U Pending JPS549672U (2) | 1977-06-21 | 1977-06-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS549672U (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62181400U (2) * | 1986-05-10 | 1987-11-17 |
-
1977
- 1977-06-21 JP JP1977082177U patent/JPS549672U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62181400U (2) * | 1986-05-10 | 1987-11-17 |