JPS5498181A - Etching method on thin plate - Google Patents

Etching method on thin plate

Info

Publication number
JPS5498181A
JPS5498181A JP492578A JP492578A JPS5498181A JP S5498181 A JPS5498181 A JP S5498181A JP 492578 A JP492578 A JP 492578A JP 492578 A JP492578 A JP 492578A JP S5498181 A JPS5498181 A JP S5498181A
Authority
JP
Japan
Prior art keywords
etching
thin plate
holder
liquid
turning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP492578A
Other languages
Japanese (ja)
Inventor
Kunio Takatsuki
Hirobumi Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP492578A priority Critical patent/JPS5498181A/en
Publication of JPS5498181A publication Critical patent/JPS5498181A/en
Pending legal-status Critical Current

Links

Landscapes

  • Weting (AREA)

Abstract

PURPOSE: To provide uniform etching by inversely turning the thin plate kept at horizontal level with the liquid surface by the thin plate turning about the center different from the center of turning etching liquid.
CONSTITUTION: Holder 6 used for supporting substrate 5 is inserted into the substrate holder bearing on etching liquid tank 1. While the etching liquid is stirred in the direction shown by arrow mark 7, holder 6 is turned to the direction shown by arrow mark 8 at the same time. Since etching liquid 4 turns in the direction opposite to that of the holder, the liquid is kept in uniform contact with the substrate, thus insuring uniform etching.
COPYRIGHT: (C)1979,JPO&Japio
JP492578A 1978-01-19 1978-01-19 Etching method on thin plate Pending JPS5498181A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP492578A JPS5498181A (en) 1978-01-19 1978-01-19 Etching method on thin plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP492578A JPS5498181A (en) 1978-01-19 1978-01-19 Etching method on thin plate

Publications (1)

Publication Number Publication Date
JPS5498181A true JPS5498181A (en) 1979-08-02

Family

ID=11597171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP492578A Pending JPS5498181A (en) 1978-01-19 1978-01-19 Etching method on thin plate

Country Status (1)

Country Link
JP (1) JPS5498181A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6090720A (en) * 1997-12-26 2000-07-18 Naoetsu Electronics Company Wet etching method for silicon semiconductor wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6090720A (en) * 1997-12-26 2000-07-18 Naoetsu Electronics Company Wet etching method for silicon semiconductor wafer

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