JPS5498572A - Surface stablization processing method for transistor - Google Patents
Surface stablization processing method for transistorInfo
- Publication number
- JPS5498572A JPS5498572A JP541178A JP541178A JPS5498572A JP S5498572 A JPS5498572 A JP S5498572A JP 541178 A JP541178 A JP 541178A JP 541178 A JP541178 A JP 541178A JP S5498572 A JPS5498572 A JP S5498572A
- Authority
- JP
- Japan
- Prior art keywords
- sio
- transistor
- stablization
- annealing
- mixing gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003672 processing method Methods 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 238000000137 annealing Methods 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Landscapes
- Bipolar Transistors (AREA)
- Formation Of Insulating Films (AREA)
Abstract
PURPOSE: To make stable the surface for the transistor substrate finished for the formation of emitter layer with annealing under N2+H2 atomosphere.
CONSTITUTION: H2 in the mixing gas of N2 and H2 is bonded with unsaturated Si or excessive Si at the boundary of Si and SiO2, and it is inactive electrically and the boundary active condition is very stabilized. Since H2 in mixing gas is effective with much amount, but it can be remained as about 10% and the treatment temperature is at about 950°C. With this method, increase in hFE at low current region, improvement in noise level, and reduction in leakage can be realized and the performance can be uniformed. Further, SiO2 is also made fine with annealing and no under etching is made at open window.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53005411A JPS5857903B2 (en) | 1978-01-20 | 1978-01-20 | Transistor surface stabilization treatment method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53005411A JPS5857903B2 (en) | 1978-01-20 | 1978-01-20 | Transistor surface stabilization treatment method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5498572A true JPS5498572A (en) | 1979-08-03 |
| JPS5857903B2 JPS5857903B2 (en) | 1983-12-22 |
Family
ID=11610395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53005411A Expired JPS5857903B2 (en) | 1978-01-20 | 1978-01-20 | Transistor surface stabilization treatment method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5857903B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5885534A (en) * | 1981-11-18 | 1983-05-21 | Komatsu Denshi Kinzoku Kk | Manufacture of semiconductor silicon |
| JPS62239548A (en) * | 1986-04-10 | 1987-10-20 | Seiko Epson Corp | Manufacturing method of semiconductor device |
| CN103390552A (en) * | 2012-05-08 | 2013-11-13 | 中国科学院微电子研究所 | an annealing system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63193302U (en) * | 1987-05-30 | 1988-12-13 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49127575A (en) * | 1973-04-06 | 1974-12-06 |
-
1978
- 1978-01-20 JP JP53005411A patent/JPS5857903B2/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49127575A (en) * | 1973-04-06 | 1974-12-06 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5885534A (en) * | 1981-11-18 | 1983-05-21 | Komatsu Denshi Kinzoku Kk | Manufacture of semiconductor silicon |
| JPS62239548A (en) * | 1986-04-10 | 1987-10-20 | Seiko Epson Corp | Manufacturing method of semiconductor device |
| CN103390552A (en) * | 2012-05-08 | 2013-11-13 | 中国科学院微电子研究所 | an annealing system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5857903B2 (en) | 1983-12-22 |
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